MCIMX6D5EZK08AD

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Ethernet :

10/100/1000Mbps (1)

Peak Reflow Temperature (Cel) :

260

Series :

i.MX6D

JESD-609 Code :

e1

Length :

12mm

Height Seated (Max) :

1.25mm

Packaging :

Tray

Format :

FIXED POINT

Boundary Scan :

yes

SATA :

SATA 3Gbps (1)

Factory Lead Time :

15 Weeks

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Low Power Mode :

yes

Core Processor :

ARM® Cortex®-A9

Display & Interface Controllers :

Keypad, LCD

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Integrated Cache :

yes

Supply Voltage-Max (Vsup) :

1.5V

Terminal Position :

BOTTOM

USB :

USB 2.0 + PHY (4)

Published :

2002

Speed :

800MHz

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

External Data Bus Width :

32

Package / Case :

569-LFBGA

Supply Voltage :

1.4V

Time@Peak Reflow Temperature-Max (s) :

40

Number of Cores/Bus Width :

2 Core 32-Bit

JESD-30 Code :

S-PBGA-B569

HTS Code :

8542.31.00.01

ECCN Code :

5A992

Supply Voltage-Min (Vsup) :

1.275V

Terminal Pitch :

0.4mm

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

RAM Controllers :

LPDDR2, LVDDR3, DDR3

RoHS Status :

ROHS3 Compliant

Surface Mount :

yes

Terminal Form :

Ball

Operating Temperature :

-20°C~105°C TJ

Address Bus Width :

26

Graphics Acceleration :

yes

Number of Terminations :

569