MCIMX6D5EYM10AD

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Peak Reflow Temperature (Cel) :

260

Number of Terminations :

624

Operating Temperature :

-20°C~105°C TJ

Terminal Position :

BOTTOM

Packaging :

Tray

Address Bus Width :

16

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Supply Voltage-Max (Vsup) :

1.5V

SATA :

SATA 3Gbps (1)

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

ECCN Code :

5A992

Core Processor :

ARM® Cortex®-A9

Number of Cores/Bus Width :

2 Core 32-Bit

Display & Interface Controllers :

Keypad, LCD

Format :

FIXED POINT

HTS Code :

8542.31.00.01

Bit Size :

64

Terminal Form :

Ball

External Data Bus Width :

64

Package / Case :

624-LFBGA, FCBGA

Series :

i.MX6D

Supply Voltage-Min (Vsup) :

1.35V

JESD-30 Code :

S-PBGA-B624

Ethernet :

10/100/1000Mbps (1)

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Time@Peak Reflow Temperature-Max (s) :

40

Length :

21mm

Terminal Pitch :

0.8mm

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

Clock Frequency :

24MHz

JESD-609 Code :

e1

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR

RoHS Status :

ROHS3 Compliant

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

USB :

USB 2.0 + PHY (4)

Surface Mount :

yes

Height Seated (Max) :

1.6mm

Low Power Mode :

yes

Graphics Acceleration :

yes

Speed :

1.0GHz

Factory Lead Time :

15 Weeks

Published :

2002

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Integrated Cache :

yes

Boundary Scan :

yes