MC9S12XEQ512CALR

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Mfr.Part #
MC9S12XEQ512CALR
Manufacturer
NXP Semiconductors
Package / Case
112-LQFP
Datasheet
Download
Description
IC MCU 16BIT 512KB FLASH 112LQFP
Stock
3,378
In Stock :
3,378

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Supply Voltage-Max (Vsup) :
1.98V
DAC Channels :
No
Terminal Form :
Gull wing
RAM Size :
32K x 8
Has ADC :
yes
Length :
20mm
Peripherals :
LVD, POR, PWM, WDT
Additional Feature :
IT ALSO REQUIRES 5 V I/O SUPPLY
Package / Case :
112-LQFP
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of I/O :
91
Surface Mount :
yes
Supply Voltage :
1.8V
Operating Temperature :
-40°C~85°C TA
Terminal Position :
QUAD
Bit Size :
32
Data Converter :
A/D 16x12b
Published :
1996
Clock Frequency :
40MHz
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Height Seated (Max) :
1.6mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Speed :
50MHz
PWM Channels :
yes
RoHS Status :
ROHS3 Compliant
Width :
20mm
EEPROM Size :
4K x 8
Core Size :
16-Bit
Series :
HCS12X
HTS Code :
8542.31.00.01
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Voltage - Supply (Vcc/Vdd) :
1.72V~5.5V
Oscillator Type :
External
JESD-30 Code :
S-PQFP-G112
Supply Voltage-Min (Vsup) :
1.72V
Qualification Status :
Not Qualified
Connectivity :
CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Factory Lead Time :
12 Weeks
Program Memory Size :
512KB 512K x 8
Mounting Type :
Surface Mount
Packaging :
Tape and Reel (TR)
Program Memory Type :
Flash
Terminal Pitch :
0.65mm
DMA Channels :
No
Number of Terminations :
112
Datasheets
MC9S12XEQ512CALR
Introducing Microcontrollers NXP Semiconductors MC9S12XEQ512CALR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:112-LQFP, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Number of Terminations:112, MC9S12XEQ512CALR pinout, MC9S12XEQ512CALR datasheet PDF, MC9S12XEQ512CALR amp .Beyond Microcontrollers NXP Semiconductors MC9S12XEQ512CALR ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors MC9S12XEQ512CALR


Microcontrollers NXP Semiconductors MC9S12XEQ512CALR Overview

The Microcontrollers NXP Semiconductors MC9S12XEQ512CALR is a highly capable microcontroller unit (MCU) designed to meet the sophisticated demands of embedded systems. Engineered by NXP Semiconductors, a leader in semiconductor innovation, this MCU features a robust 16-bit architecture and a large 512KB of integrated flash memory, making it ideal for applications requiring complex program execution and high data storage capacity. Its versatility and performance specifications make it a top choice for engineers and developers looking to leverage advanced processing capabilities and reliability in their designs.

MC9S12XEQ512CALR Features

This microcontroller offers a rich set of features to enhance its usability and functionality in complex electronic systems:

  • 16-bit HCS12X CPU core for efficient processing.
  • 512KB of on-chip flash memory, providing ample space for large applications and data storage.
  • 112-pin Low-Profile Quad Flat Package (LQFP) ensures a compact footprint suitable for space-constrained applications.
  • Integrated peripherals including multiple serial communication interfaces, which support a wide range of external devices.
  • Advanced interrupt capabilities and low-power management options for enhanced operational efficiency.

MC9S12XEQ512CALR Applications

  • Automotive Control Systems: Utilized in engine management and transmission control, where its robust processing power ensures reliable real-time performance and control.
  • Industrial Automation: Serves as the control hub for automation machinery, providing the computational power necessary to handle complex sensor data and drive operational decision-making.
  • Medical Devices: Used in medical diagnostic equipment where precision and reliability are paramount, supporting functions that require rapid data processing and stringent error handling.
  • Consumer Electronics: Powers advanced consumer electronics, such as smart home devices and wearable technology, where its capacity to manage multiple tasks simultaneously enhances user experience.
  • Telecommunication: Integral in telecommunication infrastructure, facilitating data processing and signal management to maintain robust communication channels.
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