MC9S12GC32MPBE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

CPU Family :

CPU12

Width :

10mm

JESD-609 Code :

e3

Time@Peak Reflow Temperature-Max (s) :

40

PWM Channels :

yes

RAM Size :

2K x 8

Peak Reflow Temperature (Cel) :

260

Program Memory Size :

32KB 32K x 8

Package / Case :

52-LQFP

Has ADC :

yes

Clock Frequency :

50MHz

Program Memory Type :

Flash

Power Supplies :

2.53.3/5V

DAC Channels :

No

Surface Mount :

yes

ECCN Code :

EAR99

JESD-30 Code :

S-PQFP-G52

Terminal Finish :

Matte Tin (Sn)

Connectivity :

EBI/EMI, SCI, SPI

Operating Temperature :

-40°C~125°C TA

Supply Voltage :

2.5V

Bit Size :

16

Base Part Number :

MC9S12GC32

Number of I/O :

35

DMA Channels :

No

Number of Terminations :

52

Packaging :

Tray

Oscillator Type :

Internal

Terminal Pitch :

0.65mm

ROM (words) :

32768

Length :

10mm

Supply Voltage-Max (Vsup) :

2.75V

Series :

HCS12

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Terminal Position :

QUAD

Qualification Status :

Not Qualified

Terminal Form :

Gull wing

Core Size :

16-Bit

Speed :

25MHz

RoHS Status :

ROHS3 Compliant

Voltage - Supply (Vcc/Vdd) :

2.35V~5.5V

Published :

1996

HTS Code :

8542.31.00.01

Mounting Type :

Surface Mount

Peripherals :

POR, PWM, WDT

Factory Lead Time :

10 Weeks

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Current-Max :

45mA

Height Seated (Max) :

1.7mm

Data Converter :

A/D 8x10b