MC9S12A256CPVE

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Mfr.Part #
MC9S12A256CPVE
Manufacturer
NXP Semiconductors
Package / Case
112-LQFP
Datasheet
Download
Description
IC MCU 16BIT 256KB FLASH 112LQFP
Stock
772
In Stock :
772

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Number of I/O :
91
Supply Voltage-Min (Vsup) :
2.35V
Terminal Finish :
Matte Tin (Sn)
JESD-30 Code :
S-PQFP-G112
Core Size :
16-Bit
Factory Lead Time :
10 Weeks
Series :
HCS12
Has ADC :
yes
Terminal Position :
QUAD
CPU Family :
CPU12
Time@Peak Reflow Temperature-Max (s) :
40
PWM Channels :
yes
Additional Feature :
ALSO REQUIRES 5V SUPPLY
Surface Mount :
yes
Bit Size :
16
HTS Code :
8542.31.00.01
Terminal Pitch :
0.65mm
Package / Case :
112-LQFP
Width :
20mm
Data Converter :
A/D 8x10b
Number of Terminations :
112
DMA Channels :
No
Supply Voltage :
2.5V
Mounting Type :
Surface Mount
External Data Bus Width :
16
EEPROM Size :
4K x 8
Oscillator Type :
Internal
Base Part Number :
MC9S12A256
Packaging :
Tray
RAM Size :
12K x 8
Power Supplies :
2.55V
Address Bus Width :
19
Terminal Form :
Gull wing
Length :
20mm
DAC Channels :
No
Program Memory Type :
Flash
Qualification Status :
Not Qualified
Height Seated (Max) :
1.6mm
Operating Temperature :
-40°C~85°C TA
Speed :
25MHz
Voltage - Supply (Vcc/Vdd) :
2.35V~5.25V
Supply Voltage-Max (Vsup) :
2.75V
JESD-609 Code :
e3
Peripherals :
PWM, WDT
ROM (words) :
262144
Peak Reflow Temperature (Cel) :
260
RoHS Status :
ROHS3 Compliant
Supply Current-Max :
65mA
Connectivity :
I²C, IrDA, LINbus, SPI, UART/USART
Clock Frequency :
16MHz
Published :
1996
Program Memory Size :
256KB 256K x 8
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Datasheets
MC9S12A256CPVE
Introducing Microcontrollers NXP Semiconductors MC9S12A256CPVE from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:112-LQFP, Number of Terminations:112, Mounting Type:Surface Mount, Base Part Number:MC9S12A256, Operating Temperature:-40°C~85°C TA, MC9S12A256CPVE pinout, MC9S12A256CPVE datasheet PDF, MC9S12A256CPVE amp .Beyond Microcontrollers NXP Semiconductors MC9S12A256CPVE ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors MC9S12A256CPVE


Microcontrollers NXP Semiconductors MC9S12A256CPVE Overview

The Microcontrollers NXP Semiconductors MC9S12A256CPVE is a high-performance microcontroller unit (MCU) designed to meet the demands of sophisticated embedded applications. This component features a robust 16-bit architecture, ensuring efficient handling of complex algorithms and multiple tasks. With 256KB of integrated flash memory, it provides ample space for program storage and data management, making it ideal for applications requiring quick and reliable processing capabilities. The 112LQFP package ensures compactness and ease of integration into existing designs, enhancing the appeal for developers aiming to optimize board space without compromising performance.

MC9S12A256CPVE Features

This microcontroller unit is equipped with a variety of features that enhance its usability and functionality in complex electronic systems:

  • 16-bit HCS12 core: Delivers powerful processing capabilities and efficient code execution.
  • 256KB flash memory: Ample space for application code and data storage, enabling complex applications and software updates.
  • Low power consumption: Ideal for battery-operated devices, reducing power costs and extending operational life.
  • Advanced interrupt handling: Facilitates rapid response to external events, improving device reactivity and user experience.
  • Multiple communication interfaces: Includes SPI, I2C, and CAN protocols for flexible connectivity options with other devices and systems.

MC9S12A256CPVE Applications

  • Automotive Control Systems: Employs its robust processing capabilities to manage engine functions, enhancing vehicle performance and efficiency.
  • Industrial Automation: Integrates into control systems for real-time operational management, improving precision and reliability in manufacturing processes.
  • Medical Devices: Utilized in the monitoring and diagnostic equipment, where its accuracy and dependability support critical health care applications.
  • Consumer Electronics: Drives innovation in smart home devices and personal gadgets, offering connectivity and enhanced user interfaces.
  • Telecommunications: Essential in communication infrastructure, supporting the processing needs for stable and efficient data transmission.
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