MC9S08SH8MWJR

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Peak Reflow Temperature (Cel) :

260

Data Converter :

A/D 12x10b

Height Seated (Max) :

2.65mm

Surface Mount :

yes

Number of Terminations :

20

Factory Lead Time :

22 Weeks

Peripherals :

LVD, POR, PWM, WDT

Length :

12.8mm

Width :

7.5mm

Supply Voltage :

3V

Package / Case :

20-SOIC (0.295, 7.50mm Width)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

40

Program Memory Size :

8KB 8K x 8

ROM (words) :

8192

Terminal Pitch :

1.27mm

Packaging :

Tape and Reel (TR)

JESD-30 Code :

R-PDSO-G20

RAM Size :

512 x 8

Voltage - Supply (Vcc/Vdd) :

2.7V~5.5V

Program Memory Type :

Flash

PWM Channels :

yes

Has ADC :

yes

HTS Code :

8542.31.00.01

Core Size :

8-Bit

RoHS Status :

ROHS3 Compliant

JESD-609 Code :

e3

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Supply Voltage-Min (Vsup) :

2.7V

Bit Size :

8

ECCN Code :

EAR99

DAC Channels :

No

Number of I/O :

17

RAM (bytes) :

512

Terminal Position :

Dual

Power Supplies :

3/5V

DMA Channels :

No

Qualification Status :

Not Qualified

Terminal Finish :

MATTE TIN

Series :

S08

Supply Voltage-Max (Vsup) :

5.5V

Clock Frequency :

16MHz

Speed :

40MHz

Oscillator Type :

Internal

Operating Temperature :

-40°C~125°C TA

Supply Current-Max :

7.7mA

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Mounting Type :

Surface Mount

Published :

2007

Terminal Form :

Gull wing