MC9S08QG4MDTE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Power Supplies :

1.8/3.6V

Time@Peak Reflow Temperature-Max (s) :

40

Bit Size :

8

Peripherals :

LVD, POR, PWM, WDT

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Height Seated (Max) :

1.2mm

Program Memory Size :

4KB 4K x 8

Mounting Type :

Surface Mount

Package / Case :

16-TSSOP (0.173, 4.40mm Width)

DMA Channels :

No

Supply Current-Max :

5mA

Has ADC :

yes

HTS Code :

8542.31.00.01

Width :

4.4mm

PWM Channels :

yes

RAM (bytes) :

256

Connectivity :

I2C, SCI, SPI

RoHS Status :

ROHS3 Compliant

Terminal Form :

Gull wing

Published :

2008

JESD-30 Code :

R-PDSO-G16

Supply Voltage-Max (Vsup) :

3.6V

Peak Reflow Temperature (Cel) :

260

Number of Terminations :

16

Speed :

20MHz

Factory Lead Time :

10 Weeks

Voltage - Supply (Vcc/Vdd) :

1.8V~3.6V

Length :

5mm

Oscillator Type :

Internal

Clock Frequency :

20MHz

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Pitch :

0.65mm

Supply Voltage :

3V

Data Converter :

A/D 8x10b

Surface Mount :

yes

Operating Temperature :

-40°C~125°C TA

ECCN Code :

3A991.A.2

Supply Voltage-Min (Vsup) :

1.8V

RAM Size :

256 x 8

Terminal Position :

Dual

Terminal Finish :

Matte Tin (Sn)

Core Size :

8-Bit

Qualification Status :

Not Qualified

DAC Channels :

No

JESD-609 Code :

e3

Series :

S08

Program Memory Type :

Flash

Packaging :

Tube

ROM (words) :

4096

Number of I/O :

12