MC68MH360VR25VL

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

External Data Bus Width :

32

Operating Temperature :

0°C~70°C TA

Peak Reflow Temperature (Cel) :

260

Additional Interfaces :

SCC, SMC, SPI

Supply Voltage-Min (Vsup) :

4.75V

Speed :

25MHz

HTS Code :

8542.31.00.01

Published :

1995

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Data Transfer Rate-Max :

1.25 MBps

JESD-609 Code :

e1

Supply Voltage-Max (Vsup) :

5.25V

Bus Compatibility :

MC68040; MC68030

Packaging :

Tray

Surface Mount :

yes

RAM Controllers :

DRAM

Ethernet :

10Mbps (1)

Data Encoding/Decoding Method :

NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL

Voltage - I/O :

3.3V

Low Power Mode :

yes

Length :

25mm

Address Bus Width :

32

Time@Peak Reflow Temperature-Max (s) :

40

Number of Terminations :

357

Package / Case :

357-BBGA

Communication Protocol :

BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP

Graphics Acceleration :

No

uPs/uCs/Peripheral ICs Type :

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Terminal Position :

BOTTOM

Base Part Number :

MC68MH360

Terminal Pitch :

1.27mm

Boundary Scan :

yes

Terminal Form :

Ball

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

ECCN Code :

3A991.A.2

Co-Processors/DSP :

Communications; CPM

RoHS Status :

ROHS3 Compliant

Series :

M683xx

Supply Voltage :

5V

JESD-30 Code :

S-PBGA-B357

Number of Cores/Bus Width :

1 Core 32-Bit

Clock Frequency :

25MHz

Height Seated (Max) :

1.86mm

Core Processor :

CPU32+