MC68EN360ZQ33L

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Package / Case :

357-BBGA

JESD-609 Code :

e0

Bit Size :

32

Address Bus Width :

32

Length :

25mm

Base Part Number :

MC68EN360

Number of I/O :

46

ECCN Code :

3A991.A.2

Supply Voltage-Min (Vsup) :

4.75V

RAM Controllers :

DRAM

Factory Lead Time :

16 Weeks

Time@Peak Reflow Temperature-Max (s) :

40

Speed :

33MHz

Additional Interfaces :

SCC, SMC, SPI

Peak Reflow Temperature (Cel) :

260

DMA Channels :

yes

Operating Temperature :

0°C~70°C TA

Number of Terminations :

357

RoHS Status :

Non-RoHS Compliant

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

HTS Code :

8542.31.00.01

Supply Voltage-Max (Vsup) :

5.25V

Terminal Form :

Ball

Height Seated (Max) :

1.86mm

Has ADC :

No

Number of Cores/Bus Width :

1 Core 32-Bit

Packaging :

Tray

Graphics Acceleration :

No

Co-Processors/DSP :

Communications; CPM

Surface Mount :

yes

Terminal Position :

BOTTOM

Supply Voltage :

5V

Clock Frequency :

6MHz

Ethernet :

10Mbps (1)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Series :

M683xx

Terminal Pitch :

1.27mm

External Data Bus Width :

32

Published :

1995

PWM Channels :

No

Core Processor :

CPU32+

Voltage - I/O :

5.0V

JESD-30 Code :

S-PBGA-B357

Terminal Finish :

Tin/Lead (Sn/Pb)