MC56F8365VFGE

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Operating Temperature :

-40°C~105°C TA

Connectivity :

CANbus, EBI/EMI, SCI, SPI

Internal Bus Architecture :

Multiple

Program Memory Size :

512KB 256K x 16

Surface Mount :

yes

Height Seated (Max) :

1.6mm

Packaging :

Tray

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Core Size :

16-Bit

Speed :

60MHz

External Data Bus Width :

4

Core Processor :

56800E

Time@Peak Reflow Temperature-Max (s) :

40

Published :

1998

Data Converter :

A/D 16x12b

ROM (words) :

524288

Power Supplies :

2.53.3V

ECCN Code :

3A991.A.2

Number of Terminations :

128

Peak Reflow Temperature (Cel) :

260

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Address Bus Width :

11

Factory Lead Time :

10 Weeks

Low Power Mode :

yes

Boundary Scan :

yes

HTS Code :

8542.31.00.01

Terminal Finish :

Matte Tin (Sn)

Length :

20mm

Width :

14mm

Qualification Status :

Not Qualified

Supply Voltage-Min (Vsup) :

2.25V

Program Memory Type :

Flash

Oscillator Type :

External

Supply Voltage :

2.5V

Number of I/O :

49

Terminal Position :

QUAD

Format :

FIXED POINT

JESD-30 Code :

R-PQFP-G128

JESD-609 Code :

e3

Peripherals :

POR, PWM, Temp Sensor, WDT

uPs/uCs/Peripheral ICs Type :

DIGITAL SIGNAL PROCESSOR, OTHER

Bit Size :

16

Barrel Shifter :

yes

Clock Frequency :

120MHz

Package / Case :

128-LQFP

Base Part Number :

MC56F8365

Terminal Pitch :

0.5mm

Mounting Type :

Surface Mount

Terminal Form :

Gull wing

Series :

56F8xxx

RAM Size :

18K x 16

RoHS Status :

ROHS3 Compliant

Supply Voltage-Max (Vsup) :

2.75V

Voltage - Supply (Vcc/Vdd) :

2.25V~3.6V