MC33662BLEF
- Mfr.Part #
- MC33662BLEF
- Manufacturer
- NXP Semiconductors
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC TRANSCEIVER 1/1 8SOIC
- Stock
- 9,315
- In Stock :
- 9,315
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- Drivers, Receivers, Transceivers
- Published :
- 2003
- ECCN Code :
- EAR99
- Factory Lead Time :
- 12 Weeks
- Number of Drivers/Receivers :
- 1/1
- Data Rate :
- 20kbps
- Number of Terminations :
- 8
- RoHS Status :
- ROHS3 Compliant
- Number of Functions :
- 1
- HTS Code :
- 8542.39.00.01
- Length :
- 4.9mm
- Width :
- 3.9mm
- Height Seated (Max) :
- 1.75mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Form :
- Gull wing
- Voltage - Supply :
- 7V~18V
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Finish :
- Matte Tin (Sn)
- Terminal Pitch :
- 1.27mm
- Surface Mount :
- yes
- Type :
- Transceiver
- Packaging :
- Tube
- JESD-30 Code :
- R-PDSO-G8
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Terminal Position :
- Dual
- Mounting Type :
- Surface Mount
- JESD-609 Code :
- e3
- Supply Voltage :
- 13.5V
- Operating Temperature :
- -40°C~125°C
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Protocol :
- LINbus
- Datasheets
- MC33662BLEF

[Drivers, Receivers, Transceivers - NXP Semiconductors MC33662BLEF] Overview
Introducing the cutting-edge MC33662BLEF, a revolutionary Integrated Circuit (IC) transceiver meticulously crafted by NXP Semiconductors to redefine connectivity standards. This state-of-the-art solution embodies the pinnacle of innovation, offering unparalleled performance and reliability in the realm of drivers, receivers, and transceivers.
Designed to meet the exacting demands of modern industries, the MC33662BLEF serves as the cornerstone of seamless communication networks, facilitating robust data transmission and reception with utmost precision. Its compact 8SOIC package encapsulates a myriad of advanced features, empowering businesses to optimize their operations and propel towards unprecedented efficiency.
Whether deployed in automotive, industrial, or telecommunications settings, this remarkable IC transcends boundaries, delivering unmatched versatility and resilience. With NXP Semiconductors' unwavering commitment to excellence, the MC33662BLEF emerges as the epitome of reliability, setting new benchmarks in the realm of connectivity solutions.
MC33662BLEF Features
- Highly Integrated Design: The MC33662BLEF boasts a compact form factor, integrating essential functionalities into a single, space-efficient package.
- Robust Communication: With advanced signal processing capabilities, this IC ensures seamless data transmission and reception even in challenging environments.
- Enhanced Reliability: Engineered to withstand extreme conditions, the MC33662BLEF guarantees consistent performance and longevity, minimizing downtime and maintenance costs.
- Efficient Power Management: Featuring optimized power consumption, this transceiver maximizes energy efficiency without compromising on performance.
- Wide Application Range: From automotive systems to industrial automation, the MC33662BLEF caters to diverse applications, providing unparalleled connectivity solutions across industries.
MC33662BLEF Applications
- Automotive Telematics: Leveraging the MC33662BLEF, automotive manufacturers achieve seamless integration of telematics systems, enabling real-time vehicle tracking and diagnostics for enhanced safety and efficiency on the road.
- Industrial Control Systems: In industrial settings, this IC facilitates robust communication between control units and sensors, ensuring precise monitoring and control of critical processes for optimal productivity and safety.
- Wireless Sensor Networks: Deployed in wireless sensor networks, the MC33662BLEF enables seamless connectivity between sensors and data acquisition systems, facilitating efficient data collection and analysis for various applications, from environmental monitoring to asset tracking.
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