MC33660EFR2
- Mfr.Part #
- MC33660EFR2
- Manufacturer
- NXP Semiconductors
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC INTERFACE SPECIALIZED 8SOIC
- Stock
- 7,885
- In Stock :
- 7,885
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- Specialized
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Base Part Number :
- MC33660
- JESD-30 Code :
- R-PDSO-G8
- Width :
- 3.9mm
- Packaging :
- Tape and Reel (TR)
- Voltage - Supply :
- 8V~18V
- Terminal Position :
- Dual
- Supply Voltage :
- 5V
- Terminal Finish :
- MATTE TIN
- JESD-609 Code :
- e3
- Terminal Form :
- Gull wing
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Temperature (Min) :
- -40°C
- Applications :
- Automotive
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- ECCN Code :
- EAR99
- Length :
- 4.9mm
- Operating Temperature (Max) :
- 125°C
- Mounting Type :
- Surface Mount
- Published :
- 2002
- Height Seated (Max) :
- 1.75mm
- RoHS Status :
- ROHS3 Compliant
- Peak Reflow Temperature (Cel) :
- 260
- Surface Mount :
- yes
- Number of Functions :
- 1
- HTS Code :
- 8542.39.00.01
- Telecom IC Type :
- TELECOM CIRCUIT
- Number of Terminations :
- 8
- Interface :
- Serial Link Bus Interface
- Terminal Pitch :
- 1.27mm
- Datasheets
- MC33660EFR2

Specialized NXP Semiconductors MC33660EFR2 Overview
Introducing the cutting-edge interface solution tailored for specialized applications, the MC33660EFR2 by NXP Semiconductors stands as a pinnacle of innovation in the realm of integrated circuits. Designed to excel in demanding environments, this 8SOIC package encapsulates unparalleled functionality and reliability, making it the prime choice for industrial-grade applications.
MC33660EFR2 Features
- Robust Interface: The MC33660EFR2 boasts a robust interface specially crafted to meet the rigorous demands of specialized applications, ensuring seamless connectivity and data transfer.
- High Performance: With advanced performance metrics, this IC delivers optimal functionality, enabling smooth operation even in challenging conditions.
- Compact Design: Despite its powerful capabilities, the MC33660EFR2 features a compact 8SOIC package, allowing for easy integration into space-constrained environments.
- Enhanced Reliability: Built to withstand harsh operating conditions, this NXP Semiconductors product guarantees enhanced reliability and longevity, minimizing downtime and maintenance costs.
- Wide Compatibility: Compatible with a range of devices and systems, the MC33660EFR2 offers versatile functionality, catering to diverse application requirements.
MC33660EFR2 Applications
- Industrial Automation: Leveraging its robust interface and high performance, the MC33660EFR2 finds application in industrial automation systems, facilitating seamless communication between various components and ensuring efficient operation.
- Automotive Electronics: In automotive electronics, the MC33660EFR2 plays a vital role in enabling connectivity and data exchange between different vehicle modules, enhancing overall system functionality and performance.
- Medical Devices: With its compact design and enhanced reliability, this specialized IC is well-suited for use in medical devices, where precision and dependability are paramount, ensuring seamless integration and operation within critical healthcare equipment.
- Smart Grid Solutions: The MC33660EFR2 is instrumental in smart grid solutions, where it facilitates communication and control in energy management systems, optimizing grid performance and reliability.
- Telecommunications Infrastructure: Supporting wide compatibility and robust connectivity, this NXP Semiconductors product is an ideal choice for telecommunications infrastructure, enabling efficient data transmission and network management.
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