MC17XSF500BEKR2

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Mfr.Part #
MC17XSF500BEKR2
Manufacturer
NXP Semiconductors
Package / Case
32-SSOP (0.295, 7.50mm Width) Exposed Pad
Datasheet
Download
Description
IC PWR SWITCH N-CHAN 1:1 32HSOP
Stock
45,588
In Stock :
45,588

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Manufacturer :
NXP Semiconductors
Product Category :
Power Distribution Switches, Load Drivers
Voltage - Supply (Vcc/Vdd) :
4.5V~5.5V
Voltage - Load :
18V Max
ECCN Code :
EAR99
Feature :
Internal PWM
Output Configuration :
High Side
Switch Type :
GENERAL PURPOSE
Rds On (Typ) :
7m Ω, 17m Ω
HTS Code :
8542.39.00.01
Operating Temperature :
-40°C~125°C TA
Interface :
SPI
Package / Case :
32-SSOP (0.295, 7.50mm Width) Exposed Pad
Peak Reflow Temperature (Cel) :
260
Mounting Type :
Surface Mount
Current - Output (Max) :
5.5A 11A
Number of Outputs :
6
JESD-609 Code :
e3
Time@Peak Reflow Temperature-Max (s) :
40
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Finish :
Matte Tin (Sn)
Output Type :
N-Channel
Fault Protection :
Current Limiting (Fixed), Open Load Detect, Over Temperature
Ratio - Input:Output :
1:1
RoHS Status :
ROHS3 Compliant
Packaging :
Tape and Reel (TR)
Datasheets
MC17XSF500BEKR2
Introducing Power Distribution Switches, Load Drivers NXP Semiconductors MC17XSF500BEKR2 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~125°C TA, Package / Case:32-SSOP (0.295, 7.50mm Width) Exposed Pad, Mounting Type:Surface Mount, MC17XSF500BEKR2 pinout, MC17XSF500BEKR2 datasheet PDF, MC17XSF500BEKR2 amp .Beyond Power Distribution Switches, Load Drivers NXP Semiconductors MC17XSF500BEKR2 ,we also offer AP22966DC8-7, AP22800HB-7, AP22653W6-7, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors MC17XSF500BEKR2


Power Distribution Switches, Load Drivers NXP Semiconductors MC17XSF500BEKR2 Overview

The Power Distribution Switches, Load Drivers NXP Semiconductors MC17XSF500BEKR2 is a highly efficient, robust power switch designed for high-performance applications that require reliable power distribution. This device is engineered by NXP Semiconductors, a leader in semiconductor technology, ensuring top-tier performance and quality. With its compact 32-HSOP package, the MC17XSF500BEKR2 is tailored for systems that demand minimal footprint without compromising power handling capabilities. It is ideal for applications requiring precise power control and robust protection features.

MC17XSF500BEKR2 Features

The MC17XSF500BEKR2 features include single N-channel power distribution with a 1:1 switch ratio, designed for high-efficiency power management. The device supports advanced protection mechanisms against overcurrent, overheating, and voltage surges, enhancing system reliability. Its 32-HSOP package ensures a compact design, suitable for space-constrained applications while providing excellent thermal performance.

MC17XSF500BEKR2 Applications

  • Automotive Systems: Used in vehicle power management systems to control power distribution efficiently and safely across multiple subsystems.
  • Industrial Automation: Implements robust power control within automated manufacturing lines, ensuring reliable operation under high load conditions.
  • Portable Devices: Integrates into portable electronics to manage power distribution, optimizing battery life and device performance.
  • Networking Equipment: Employs in networking gear for stable power distribution, essential for maintaining uninterrupted service and performance.
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Shipping Cost

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