MC14077BCPG

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Mfr.Part #
MC14077BCPG
Manufacturer
onsemi
Package / Case
14-DIP (0.300, 7.62mm)
Datasheet
Download
Description
IC GATE XNOR 4CH 2-INP 14DIP
Stock
15,749
In Stock :
15,749

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Manufacturer :
onsemi
Product Category :
Gates and Inverters
Terminal Position :
Dual
Time@Peak Reflow Temperature-Max (s) :
40
Quiescent Current :
1μA
Number of Pins :
14
Number of Inputs :
2
Terminal Finish :
Tin (Sn)
Height :
3.683mm
Published :
2006
Packaging :
Tube
Supply Voltage-Min (Vsup) :
3V
RoHS Status :
RoHS Compliant
Supply Voltage :
5V
JESD-609 Code :
e3
Logic Level - High :
3.5V ~ 11V
Max Propagation Delay @ V, Max CL :
110ns @ 15V, 50pF
Package / Case :
14-DIP (0.300, 7.62mm)
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Pin Count :
14
Width :
6.604mm
Number of Gates :
4
Number of Terminations :
14
Mount :
Through Hole
Logic Function :
NOR, XNOR
Propagation Delay :
110 ns
Logic Type :
XNOR (Exclusive NOR)
Turn On Delay Time :
350 ns
Radiation Hardening :
No
Max Output Current :
8.8mA
Logic Level - Low :
1.5V ~ 4V
Lead Free :
Lead Free
Current - Output High, Low :
8.8mA 8.8mA
Output Current :
8.8mA
Peak Reflow Temperature (Cel) :
260
Base Part Number :
4077
Series :
4000B
Weight :
4.535924g
Length :
19.558mm
Number of Outputs :
1
Number of Functions :
4
Mounting Type :
Through Hole
Operating Temperature :
-55°C~125°C
Load Capacitance :
50pF
Voltage - Supply :
3V~18V
Packing Method :
Rail
Schmitt Trigger :
No
Pbfree Code :
yes
REACH SVHC :
No SVHC
Datasheets
MC14077BCPG
Introducing Gates and Inverters onsemi MC14077BCPG from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:14, Package / Case:14-DIP (0.300, 7.62mm), Number of Terminations:14, Base Part Number:4077, Mounting Type:Through Hole, Operating Temperature:-55°C~125°C, MC14077BCPG pinout, MC14077BCPG datasheet PDF, MC14077BCPG amp .Beyond Gates and Inverters onsemi MC14077BCPG ,we also offer 74AHC08BQ,115, HEF4093BT,653, HEF4093BT,652, Our vast inventory has you covered. Contact us now for immediate solutions.

onsemi MC14077BCPG


Gates and Inverters onsemi MC14077BCPG Overview

Introducing the MC14077BCPG from onsemi, a cutting-edge Integrated Circuit (IC) designed to revolutionize your digital logic operations. This 14-pin DIP package hosts a powerful XNOR gate featuring four channels with dual inputs, ensuring robust functionality for your electronic projects. Crafted with precision and innovation, this IC embodies the pinnacle of semiconductor engineering, delivering unparalleled performance and reliability.

With its compact design and versatile capabilities, the MC14077BCPG empowers engineers and manufacturers to elevate their designs to new heights. Whether you're crafting intricate electronic systems or optimizing industrial processes, this IC provides the foundation for seamless integration and efficient operation.

Unlock a world of possibilities with the MC14077BCPG – your gateway to enhanced digital logic solutions.

MC14077BCPG Features

  • High-performance XNOR gate IC
  • Four channels with dual inputs
  • 14-pin DIP package for easy integration
  • Precision engineering for reliable operation
  • Wide range of operating voltages
  • Low power consumption
  • Robust design for industrial applications
  • Temperature and voltage stability

MC14077BCPG Applications

  • Industrial Automation: Implement XNOR logic operations in automated control systems for enhanced efficiency and precision. The MC14077BCPG ensures reliable signal processing, making it ideal for PLCs, motor control, and robotic applications.
  • Consumer Electronics: Integrate the MC14077BCPG into consumer electronic devices such as calculators, digital clocks, and remote controls to facilitate logical decision-making and data processing. Its compact size and low power consumption make it perfect for battery-operated devices.
  • Communications Systems: Enhance the performance of communication networks and data transmission equipment by incorporating the MC14077BCPG. From signal encoding to error detection, this IC enables seamless operation in telecommunications infrastructure and networking devices.
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