MAX7313AEG+

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Mfr.Part #
MAX7313AEG+
Manufacturer
Analog Devices, Inc.
Package / Case
24-SSOP (0.154, 3.90mm Width)
Datasheet
Download
Description
IC I/O EXPANDER I2C 16B 24QSOP
Stock
20
In Stock :
20

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Manufacturer :
Analog Devices, Inc.
Product Category :
I/O Expanders
Interface :
I2C, SMBus
Voltage - Supply :
2V~3.6V
Clock Frequency :
400kHz
Package / Case :
24-SSOP (0.154, 3.90mm Width)
Number of Bits :
1
Output Type :
Open Drain
JESD-609 Code :
e3
Number of Pins :
24
Operating Temperature :
-40°C~125°C
Lead Free :
Lead Free
Qualification Status :
Not Qualified
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Terminal Pitch :
0.635mm
Supply Voltage :
3.3V
Base Part Number :
MAX7313
Feature :
PWM
Terminal Finish :
Tin
Terminal Position :
Dual
Pbfree Code :
yes
Number of Ports :
1
Published :
2011
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Number of Terminations :
24
Power Supplies :
2.5/3.3V
Mount :
Surface Mount
Terminal Form :
Gull wing
uPs/uCs/Peripheral ICs Type :
PARALLEL IO PORT, GENERAL PURPOSE
Height Seated (Max) :
1.73mm
Packaging :
Tape and Reel (TR)
Output Current :
50mA
Operating Supply Voltage :
3.6V
RoHS Status :
ROHS3 Compliant
Factory Lead Time :
6 Weeks
Number of I/O :
16
Power Dissipation :
761mW
Width :
3.9mm
Interrupt Output :
yes
ECCN Code :
EAR99
Peak Reflow Temperature (Cel) :
260
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Pin Count :
24
Length :
8.65mm
Datasheets
MAX7313AEG+
Introducing I/O Expanders Analog Devices, Inc. MAX7313AEG+ from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:24-SSOP (0.154, 3.90mm Width), Number of Pins:24, Operating Temperature:-40°C~125°C, Mounting Type:Surface Mount, Base Part Number:MAX7313, Number of Terminations:24, MAX7313AEG+ pinout, MAX7313AEG+ datasheet PDF, MAX7313AEG+ amp .Beyond I/O Expanders Analog Devices, Inc. MAX7313AEG+ ,we also offer XRA1405IL24-F, CY8C9520A-24PVXIT, MAX7315AUE+, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. MAX7313AEG+


[I/O Expanders Analog Devices, Inc. MAX7313AEG+] Overview

Introducing the MAX7313AEG+ by Analog Devices, Inc., a versatile and efficient solution for expanding input/output capabilities in electronic systems. Engineered with precision and reliability in mind, this integrated circuit (IC) is designed to seamlessly integrate into various applications, offering enhanced functionality and flexibility.

With its compact form factor and advanced features, the MAX7313AEG+ simplifies the task of interfacing with peripheral devices, enabling seamless communication and control. Whether you're designing consumer electronics, industrial automation systems, or IoT devices, this I/O expander delivers exceptional performance and adaptability, making it an ideal choice for demanding B2B environments.

MAX7313AEG+ Features

  • Highly integrated I2C-controlled I/O expander
  • 16 bidirectional I/O ports configurable as inputs or outputs
  • Wide operating voltage range for compatibility with various systems
  • Configurable I2C slave address for multiple device operation
  • Low standby current for power-efficient operation
  • 24-pin QSOP package for easy integration into PCB layouts
  • Robust ESD protection for enhanced reliability

MAX7313AEG+ Applications

  • Industrial Automation: Utilize the MAX7313AEG+ to expand I/O capabilities in industrial control systems, enabling seamless interfacing with sensors, actuators, and other peripheral devices. Its configurable I/O ports and robust design make it ideal for harsh industrial environments.
  • Consumer Electronics: Enhance the functionality of consumer electronic devices such as smart home appliances, multimedia systems, and gaming peripherals. The MAX7313AEG+ facilitates efficient communication and control, contributing to a superior user experience.
  • Internet of Things (IoT): Empower IoT devices with expanded I/O capabilities for sensor data acquisition, device control, and communication. The MAX7313AEG+ offers a reliable and versatile solution for IoT applications, ensuring seamless connectivity and interoperability.
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