MAX3076EESD+

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Mfr.Part #
MAX3076EESD+
Manufacturer
Analog Devices, Inc.
Package / Case
14-SOIC (0.154, 3.90mm Width)
Datasheet
Download
Description
IC TRANSCEIVER FULL 1/1 14SOIC
Stock
8
In Stock :
8

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Manufacturer :
Analog Devices, Inc.
Product Category :
Drivers, Receivers, Transceivers
REACH SVHC :
No SVHC
Operating Temperature :
-40°C~85°C
Driver Number of Bits :
1
Protocol :
RS422, RS485
Transmit Delay-Max :
50 ns
Published :
2003
Max Power Dissipation :
667mW
Contact Plating :
Tin
Time@Peak Reflow Temperature-Max (s) :
30
Width :
4mm
Nominal Supply Current :
1.5mA
Receiver Hysteresis :
100mV
Terminal Finish :
Tin
Peak Reflow Temperature (Cel) :
260
Terminal Form :
Gull wing
Receive Delay-Max :
75 ns
Type :
Transceiver
Pin Count :
14
Simplex/Duplex :
Full Duplex
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Supply Voltage :
3.3V
RoHS Status :
ROHS3 Compliant
Lead Free :
Lead Free
Data Rate :
16Mbps
Termination :
SMD/SMT
Voltage - Supply :
3V~3.6V
Pbfree Code :
yes
Base Part Number :
MAX3076
Factory Lead Time :
6 Weeks
Logic Function :
Receiver, Transceiver
Number of Receivers :
1
Number of Pins :
14
Length :
8.75mm
Input Characteristics :
DIFFERENTIAL SCHMITT TRIGGER
Interface :
RS-422, RS-485
Duplex :
Full
JESD-609 Code :
e3
Terminal Position :
Dual
Mount :
Surface Mount
ECCN Code :
EAR99
Differential Output :
yes
Number of Functions :
1
Number of Drivers/Receivers :
1/1
Height :
1.5mm
Radiation Hardening :
No
Operating Supply Voltage :
3.3V
Mounting Type :
Surface Mount
Packaging :
Tube
Number of Terminations :
14
Package / Case :
14-SOIC (0.154, 3.90mm Width)
Datasheets
MAX3076EESD+
Introducing Drivers, Receivers, Transceivers Analog Devices, Inc. MAX3076EESD+ from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C, Type:Transceiver, Base Part Number:MAX3076, Number of Pins:14, Mounting Type:Surface Mount, Number of Terminations:14, Package / Case:14-SOIC (0.154, 3.90mm Width), MAX3076EESD+ pinout, MAX3076EESD+ datasheet PDF, MAX3076EESD+ amp .Beyond Drivers, Receivers, Transceivers Analog Devices, Inc. MAX3076EESD+ ,we also offer SP3232EBCN-L/TR, MAX202IDR, THVD1400DR, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. MAX3076EESD+


Drivers, Receivers, Transceivers Analog Devices, Inc. MAX3076EESD+ Overview

The Drivers, Receivers, Transceivers Analog Devices, Inc. MAX3076EESD+ is a high-performance integrated circuit designed for robust data communication in harsh environments. This IC transceiver seamlessly integrates full duplex communication capability within a compact 14SOIC package, making it ideal for applications requiring high reliability and communication integrity. Engineered by Analog Devices, a leader in semiconductor design, the MAX3076EESD+ ensures efficient data handling with minimal signal degradation, even under extreme conditions, making it a top choice for designers focusing on automotive and industrial data buses.

MAX3076EESD+ Features

The MAX3076EESD+ IC Transceiver includes numerous features that make it highly effective for demanding applications. These features include full duplex capability, which allows simultaneous send and receive operations for enhanced data flow. The device's robust ESD protection exceeds IEC 1000-4-2 standards, safeguarding against electrostatic discharges and ensuring the longevity and reliability of the application. It operates over a wide temperature range, making it suitable for automotive and industrial environments where operational conditions can be harsh.

MAX3076EESD+ Applications

  • Automotive Networks: Used in vehicle bus systems to provide reliable data transmission between electronic control units (ECUs).
  • Industrial Automation: Facilitates communication in automated production lines, ensuring accurate and uninterrupted data exchange across devices.
  • Building Automation: Employs in systems controlling HVAC and lighting, enhancing efficiency and reducing operational costs.
  • Telecommunication Equipment: Integrates into telecom infrastructures to bolster signal integrity and communication reliability across extended distances.
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