M3087BFLGP#U3

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Mfr.Part #
M3087BFLGP#U3
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
144-LQFP
Datasheet
Download
Description
IC MCU 16/32BIT 1MB FLSH 144LQFP
Stock
1,687
In Stock :
1,687

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Microcontrollers
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Address Bus Width :
24
Base Part Number :
M3087
Core Processor :
M32C/80
Package / Case :
144-LQFP
Program Memory Type :
Flash
Mount :
Surface Mount
Operating Temperature :
-40°C~85°C TA
Number of Pins :
144
RAM Size :
48K x 8
Published :
2008
PWM Channels :
yes
Oscillator Type :
Internal
Supply Voltage :
5V
Mounting Type :
Surface Mount
Number of Timers/Counters :
12
Watchdog Timer :
yes
On Chip Program ROM Width :
8
Pin Count :
144
Supply Voltage-Min (Vsup) :
4.2V
RoHS Status :
ROHS3 Compliant
Additional Feature :
ALSO OPERATES AT 3V MINIMUM SUPPLY AT 24 MHZ; ADC IS 18-CH 10-BIT IN MEMORY EXPANSION AND UP MODE
Radiation Hardening :
No
Height Seated (Max) :
1.7mm
Data Bus Width :
16b
DAC Channels :
yes
Frequency :
32MHz
Terminal Form :
Gull wing
ROM (words) :
1048576
Series :
M16C™ M32C/80/87
Length :
20mm
Number of I/O :
121
Has ADC :
yes
Supply Voltage-Max (Vsup) :
5.5V
Pbfree Code :
yes
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
ECCN Code :
3A991.A.2
Connectivity :
I²C, UART/USART
Peripherals :
DMA, POR, PWM, WDT
HTS Code :
8542.31.00.01
Packaging :
Tray
Number of Terminations :
144
Lead Free :
Lead Free
Bit Size :
32
Interface :
CAN, EBI/EMI, I2C, IrDA, UART, USART
Factory Lead Time :
20 Weeks
Voltage - Supply (Vcc/Vdd) :
3V~5.5V
Access Time :
32 μs
Memory Size :
1Mb
DMA Channels :
yes
Terminal Position :
QUAD
Data Converter :
A/D 34x10b; D/A 2x8b
Program Memory Size :
1MB 1M x 8
Number of Programmable I/O :
123
Core Size :
16/32-Bit
Terminal Pitch :
0.5mm
Datasheets
M3087BFLGP#U3
Introducing Microcontrollers Intersil (Renesas Electronics Corporation) M3087BFLGP#U3 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:M3087, Package / Case:144-LQFP, Operating Temperature:-40°C~85°C TA, Number of Pins:144, Mounting Type:Surface Mount, Number of Terminations:144, M3087BFLGP#U3 pinout, M3087BFLGP#U3 datasheet PDF, M3087BFLGP#U3 amp .Beyond Microcontrollers Intersil (Renesas Electronics Corporation) M3087BFLGP#U3 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) M3087BFLGP#U3


Microcontrollers Intersil (Renesas Electronics Corporation) M3087BFLGP#U3 Overview

Introducing the Microcontrollers Intersil (Renesas Electronics Corporation) M3087BFLGP#U3, a state-of-the-art microcontroller unit (MCU) that blends high performance with advanced integration. This MCU is designed to cater to demanding applications, featuring a robust 16/32-bit architecture and an expansive 1MB of flash memory. Housed in a 144LQFP package, it offers a compact solution with ample GPIOs for versatile connectivity and control options, making it ideal for high-volume, sophisticated embedded systems.

M3087BFLGP#U3 Features

The M3087BFLGP#U3 MCU is packed with features designed for reliability and peak performance. Key features include a dual-mode 16/32-bit processor that allows for optimized code density and power efficiency. The large 1MB flash memory is well-suited for applications requiring substantial code storage or complex firmware environments. Additionally, the 144LQFP package ensures a balanced approach between board space and pin accessibility, making it easier to integrate into various designs without sacrificing functionality.

M3087BFLGP#U3 Applications

  • Automotive Control Systems: Utilizes its robust processing capabilities to manage complex automotive control tasks, enhancing vehicle performance and safety.
  • Industrial Automation: Employs its ample GPIOs and high memory capacity to handle control operations in automated production lines, improving efficiency and reliability.
  • Consumer Electronics: Perfect for integration in smart home devices, where its compact size and power efficiency optimize functionality and user experience.
  • Healthcare Devices: Supports the demands of medical monitoring equipment by providing dependable, precise control needed in critical healthcare environments.
  • Telecommunication Infrastructure: Facilitates enhanced processing power and connectivity options necessary for managing telecommunication networks.
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