M2GL100-1FCG1152
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- Mfr.Part #
- M2GL100-1FCG1152
- Manufacturer
- Microsemi
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 574 I/O 1152FCBGA
- Stock
- 32,352
- In Stock ：
- 32,352
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- Manufacturer :
- Microsemi
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Logic Elements/Cells :
- 99512
- Number of Outputs :
- 574
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Power Supplies :
- 1.2V
- Total RAM Bits :
- 3637248
- Operating Temperature :
- 0°C~85°C TJ
- Mount :
- Surface Mount
- Voltage - Supply :
- 1.14V~2.625V
- Number of Inputs :
- 574
- Number of I/O :
- 574
- JESD-30 Code :
- S-PBGA-B1152
- RoHS Status :
- RoHS Compliant
- RAM Size :
- 444kB
- Base Part Number :
- M2GL100
- Reach Compliance Code :
- Unknown
- Terminal Form :
- Ball
- Qualification Status :
- Not Qualified
- Series :
- IGLOO2
- Terminal Position :
- BOTTOM
- Published :
- 2013
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Package / Case :
- 1152-BBGA, FCBGA
- Supply Voltage :
- 1.2V
- Packaging :
- Tray
- Terminal Pitch :
- 1mm
- Datasheets
- M2GL100-1FCG1152
FPGAs Microsemi M2GL100-1FCG1152 Overview
Introducing the FPGAs Microsemi M2GL100-1FCG1152, a highly versatile IC FPGA designed by Microsemi, tailored for advanced digital circuit applications. This product is encapsulated in a 1152-pin FCBGA (Flip Chip Ball Grid Array) package, ensuring robust performance with enhanced signal integrity. Boasting 574 I/Os, it offers extensive connectivity options, making it a formidable choice for developers aiming to integrate multifunctionality into their designs. Its architecture enables exceptional customization and adaptability, fostering innovation across various high-tech industries.
M2GL100-1FCG1152 Features
The M2GL100-1FCG1152 IC FPGA from Microsemi is equipped with features designed for high performance and flexibility. Key attributes include the large number of Input/Output pins, which facilitate extensive interfacing capabilities. The 1152FCBGA packaging not only aids in efficient thermal management but also allows for a compact footprint, making it ideal for densely-packed electronics. Furthermore, the chip is designed to support complex programmable logic designs with reduced power consumption and increased reliability.
M2GL100-1FCG1152 Applications
- Telecommunications: Utilized in switching and signal processing within network equipment to enhance performance and data flow efficiency.
- Industrial Automation: Integral in the control systems of automated assembly lines, improving precision and adaptability in manufacturing processes.
- Automotive: Plays a critical role in driver assistance systems and in-vehicle infotainment (IVI) systems, providing the necessary computational power and connectivity.
- Medical Equipment: Applied in medical imaging systems, such as MRI and ultrasound devices, to process complex imaging data and support diagnostics enhancements.
- Consumer Electronics: Used in high-performance gaming consoles and home entertainment systems to manage multiple operations and enhance user interface experiences.
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