M2GL090-1FGG676I

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Mfr.Part #
M2GL090-1FGG676I
Manufacturer
Microchip Technology
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 425 I/O 676FBGA
Stock
34,703
In Stock :
34,703

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Manufacturer :
Microchip Technology
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
Supply Voltage :
1.2V
Total RAM Bits :
2648064
Packaging :
Tray
Operating Supply Voltage :
1.2V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
-40°C~100°C TJ
Voltage - Supply :
1.14V~2.625V
Number of Logic Elements/Cells :
86316
Width :
27mm
Length :
27mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Factory Lead Time :
12 Weeks
Surface Mount :
yes
Speed Grade :
1
Terminal Position :
BOTTOM
Terminal Form :
Ball
Number of Pins :
676
Peak Reflow Temperature (Cel) :
260
RAM Size :
323.3kB
Time@Peak Reflow Temperature-Max (s) :
30
Qualification Status :
Not Qualified
Number of Terminations :
676
Height Seated (Max) :
2.44mm
Number of I/O :
425
Number of Outputs :
425
Series :
IGLOO2
Base Part Number :
M2GL090
RoHS Status :
RoHS Compliant
Lifecycle Status :
IN PRODUCTION (Last Updated: 3 weeks ago)
Published :
2013
Package / Case :
676-BGA
Datasheets
M2GL090-1FGG676I
Introducing FPGAs (Field Programmable Gate Array) Microchip Technology M2GL090-1FGG676I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Number of Pins:676, Number of Terminations:676, Base Part Number:M2GL090, Package / Case:676-BGA, M2GL090-1FGG676I pinout, M2GL090-1FGG676I datasheet PDF, M2GL090-1FGG676I amp .Beyond FPGAs (Field Programmable Gate Array) Microchip Technology M2GL090-1FGG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology M2GL090-1FGG676I


FPGAs Microchip Technology M2GL090-1FGG676I Overview

Introducing the FPGAs Microchip Technology M2GL090-1FGG676I, a highly advanced IC FPGA from Microchip Technology, designed to meet the rigorous demands of modern digital applications. This component is housed in a 676-pin FBGA package, providing a compact form factor while offering an extensive array of 425 I/O pins for versatile connectivity. Engineered for optimal performance and reliability, the M2GL090-1FGG676I serves as a cornerstone for developing sophisticated electronics that require programmable logic solutions.

M2GL090-1FGG676I Features

The M2GL090-1FGG676I FPGA offers a robust set of features that cater to a diverse range of applications. Key attributes include its large number of input/output options, which facilitate comprehensive integration with other system components. This FPGA is designed for high-speed performance, ensuring minimal latency in data processing and transfer. The 676FBGA packaging not only supports a high density of I/O connections but also aids in efficient thermal management, enhancing the device's durability and operational stability under varying environmental conditions.

M2GL090-1FGG676I Applications

  • Telecommunications Equipment: Utilized in routers, switches, and base stations where high-speed data processing and connectivity are paramount.
  • Automotive Systems: Employs in advanced driver-assistance systems (ADAS) for real-time processing of sensor data, contributing to enhanced vehicular safety and functionality.
  • Consumer Electronics: Incorporated into smart home devices and high-performance gaming consoles, providing the necessary flexibility and processing power for user interface enhancements and multimedia handling.
  • Industrial Automation: Applied in control systems and robotics, facilitating complex computations and the control of machinery with precision and reliability.
  • Medical Devices: Essential in the development of medical imaging systems, helping to process large volumes of data with high accuracy and minimal delay.
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