M2GL060-FG676I
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- Mfr.Part #
- M2GL060-FG676I
- Manufacturer
- Microchip Technology
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 387 I/O 676FBGA
- Stock
- 13,085
- In Stock ：
- 13,085
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- Manufacturer :
- Microchip Technology
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Surface Mount :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Total RAM Bits :
- 1869824
- Height Seated (Max) :
- 2.44mm
- Length :
- 27mm
- Width :
- 27mm
- Operating Temperature :
- -40°C~100°C TJ
- JESD-30 Code :
- S-PBGA-B676
- Mounting Type :
- Surface Mount
- RoHS Status :
- Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Number of I/O :
- 387
- Terminal Pitch :
- 1mm
- Factory Lead Time :
- 6 Weeks
- Peak Reflow Temperature (Cel) :
- 240
- Number of Terminations :
- 676
- Package / Case :
- 676-BGA
- Published :
- 2015
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Series :
- IGLOO2
- Terminal Form :
- Ball
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Supply Voltage :
- 1.2V
- Voltage - Supply :
- 1.14V~2.625V
- Terminal Position :
- BOTTOM
- Number of Logic Elements/Cells :
- 56520
- HTS Code :
- 8542.39.00.01
- Packaging :
- Tray
- Datasheets
- M2GL060-FG676I
FPGAs Microchip Technology M2GL060-FG676I Overview
Embark on an innovative journey with the FPGas Microchip Technology M2GL060-FG676I, a cutting-edge Field Programmable Gate Array (FPGA) designed by the renowned Microchip Technology. This powerful IC delivers not just versatility but also robust performance, tailored to meet the high demands of modern electronic applications. Utilizing a fine-pitch Ball Grid Array package (676-FBGA), the M2GL060-FG676I is engineered for optimal integration in densely packed circuitry, offering an extensive range of I/O options with its 387 I/O pins. This product exhibits a harmonious blend of high-speed functionality and energy efficiency, embodying the prowess to power through complex processing tasks while maintaining a low power footprint, encouraging B2B clients to leverage this technology for volume deployment in their sophisticated ecosystems.
M2GL060-FG676I Features
- 387 I/O pins offering extensive connectivity options
- Embedded in a compact 676-pin Fine-pitch Ball Grid Array (FBGA) packaging
- Manufactured by Microchip Technology, a leader in FPGA design
M2GL060-FG676I Applications
- Industrial Control Systems: Implements logic control and real-time processing for automated machinery.
- Telecommunication Infrastructure: Enhances signal processing capabilities in networking equipment.
- Automotive Electronics: Serves crucial roles from driver assistance to infotainment system integration.
- Medical Devices: Provides the processing power necessary for diagnostic and imaging equipment.
- Aerospace and Defense: Performs reliably in mission-critical applications requiring robust computation.
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