M29W320DT70N3E
- Mfr.Part #
- M29W320DT70N3E
- Manufacturer
- Micron Technology
- Package / Case
- 48-TFSOP (0.724, 18.40mm Width)
- Datasheet
- Download
- Description
- IC FLASH 32MBIT PARALLEL 48TSOP
- Stock
- 20,313
- In Stock :
- 20,313
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Additional Feature :
- TOP BOOT BLOCK
- Organization :
- 2MX16
- Nominal Supply Current :
- 10mA
- Terminal Pitch :
- 0.5mm
- Density :
- 32 Mb
- Boot Block :
- Top
- Memory Type :
- Non-Volatile
- Radiation Hardening :
- No
- Voltage - Supply :
- 2.7V~3.6V
- Number of Sectors/Size :
- 12163
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Pin Count :
- 48
- Base Part Number :
- M29W320
- Voltage :
- 2.7V
- Sync/Async :
- ASYNCHRONOUS
- Surface Mount :
- yes
- Power Supplies :
- 3.3V
- Peak Reflow Temperature (Cel) :
- 260
- Length :
- 18.4mm
- JESD-609 Code :
- e3
- Number of Pins :
- 48
- Standby Current-Max :
- 0.0001A
- Memory Width :
- 16
- Command User Interface :
- yes
- Write Cycle Time - Word, Page :
- 70ns
- Package / Case :
- 48-TFSOP (0.724, 18.40mm Width)
- RoHS Status :
- ROHS3 Compliant
- Toggle Bit :
- yes
- Pbfree Code :
- yes
- Operating Temperature :
- -40°C~125°C TA
- Data Polling :
- yes
- Memory Interface :
- Parallel
- Memory Format :
- Flash
- Common Flash Interface :
- yes
- ECCN Code :
- 3A991.B.1.A
- Number of Functions :
- 1
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 1.2mm
- HTS Code :
- 8542.32.00.51
- Access Time (Max) :
- 70 ns
- Supply Voltage :
- 3.3V
- Sector Size :
- 16K8K32K64K
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Terminations :
- 48
- Memory Size :
- 32Mb 4M x 8 2M x 16
- Width :
- 12mm
- Terminal Position :
- Dual
- Ready/Busy :
- yes
- Packaging :
- Tray
- Published :
- 2010
- Terminal Finish :
- MATTE TIN
- Alternate Memory Width :
- 8
- Datasheets
- M29W320DT70N3E

Memory Micron Technology M29W320DT70N3E Overview
The Memory Micron Technology M29W320DT70N3E is a robust 32Mbit FLASH memory chip, designed for high-performance and durability in complex applications. This IC utilizes a parallel interface, encapsulated in a 48-pin TSOP (Thin Small Outline Package), ensuring compact integration and reliability. It is engineered to meet the rigorous demands of high-speed computing and storage systems, making it an ideal choice for manufacturers looking to implement reliable data storage solutions. Its high data integrity and fast access times support applications where quick retrieval and data security are priorities, thus attracting B2B customers seeking bulk purchasing options for advanced technology implementations.
M29W320DT70N3E Features
This integrated circuit is characterized by several key features that make it highly efficient and versatile for a wide range of applications. It offers a storage capacity of 32MBits, which is essential for systems requiring large amounts of data in a compact form factor. The parallel interface ensures compatibility with a variety of existing technologies while providing a reliable pathway for high-speed data transactions. Additionally, its endurance and ability to operate under extended temperature ranges make it suitable for industrial environments where reliability is critical.
M29W320DT70N3E Applications
- Embedded Systems: Utilized in microcontroller-based platforms to enhance booting and firmware storage processes.
- Consumer Electronics: Key component in consumer devices like set-top boxes and gaming consoles for BIOS and firmware operations.
- Automotive: Deployed in automotive electronics for storing sensitive data crucial to vehicle operations and infotainment systems.
- Telecommunication: Applied in networking hardware such as routers and switches for firmware storage and quick data access essential for system stability and performance.
- Industrial Control Systems: Used in industrial environments for reliable, long-term data storage in monitoring and control equipment.
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