M29W256GH70N6E
- Mfr.Part #
- M29W256GH70N6E
- Manufacturer
- Micron Technology
- Package / Case
- 56-TFSOP (0.724, 18.40mm Width)
- Datasheet
- Download
- Description
- IC FLASH 256MBIT PARALLEL 56TSOP
- Stock
- 39,809
- In Stock :
- 39,809
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Height Seated (Max) :
- 1.2mm
- Common Flash Interface :
- yes
- Memory Format :
- Flash
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage :
- 3V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Organization :
- 16MX16
- Number of Pins :
- 56
- Memory Interface :
- Parallel
- Boot Block :
- BOTTOM/TOP
- Voltage :
- 2.7V
- Sector Size :
- 128K
- Number of Functions :
- 1
- Length :
- 20mm
- Data Polling :
- yes
- Contact Plating :
- Gold, Tin
- Memory Size :
- 256Mb 32M x 8 16M x 16
- Radiation Hardening :
- No
- Nominal Supply Current :
- 10mA
- Sync/Async :
- ASYNCHRONOUS
- Access Time (Max) :
- 70 ns
- Terminal Position :
- Dual
- Alternate Memory Width :
- 8
- ECCN Code :
- 3A991.B.1.A
- Pin Count :
- 56
- Width :
- 14mm
- HTS Code :
- 8542.32.00.51
- Power Supplies :
- 3/3.3V
- Number of Sectors/Size :
- 256
- Write Cycle Time-Max (tWC) :
- 0.00007ms
- Voltage - Supply :
- 2.7V~3.6V
- Package / Case :
- 56-TFSOP (0.724, 18.40mm Width)
- Number of Terminations :
- 56
- Memory Type :
- Non-Volatile
- Packaging :
- Tray
- Operating Temperature :
- -40°C~85°C TA
- Ready/Busy :
- yes
- Memory Width :
- 16
- Write Cycle Time - Word, Page :
- 70ns
- Toggle Bit :
- yes
- JESD-609 Code :
- e3
- Surface Mount :
- yes
- Mounting Type :
- Surface Mount
- Page Size :
- 8/16words
- Terminal Finish :
- MATTE TIN
- RoHS Status :
- ROHS3 Compliant
- Published :
- 2006
- Standby Current-Max :
- 0.0001A
- Peak Reflow Temperature (Cel) :
- 260
- Command User Interface :
- yes
- Base Part Number :
- M29W256
- Pbfree Code :
- yes
- Terminal Pitch :
- 0.5mm
- Density :
- 256 Mb
- Datasheets
- M29W256GH70N6E

Memory Micron Technology M29W256GH70N6E Overview
The Memory Micron Technology M29W256GH70N6E IC is a high-capacity, parallel interface flash memory module designed for applications that require fast access and high-volume data storage. Offering a robust storage capability of 256 Mbits, this memory device from Micron Technology is packaged in a practical 56TSOP configuration, providing ease of integration and reliability for system designers. This memory IC excels in environments where durability and dependability are paramount, supporting a wide range of temperatures and operating conditions.
M29W256GH70N6E Features
The M29W256GH70N6E flash memory chip features a parallel interface for quick data transfer rates and simple integration with a variety of microprocessors and digital signal processors. With its 256 Mbit storage capacity, it provides ample space for high-density data applications. The device operates over a standard voltage range, ensuring compatibility with existing systems while minimizing power consumption. Its TSOP packaging allows for efficient heat dissipation and reduced space requirements on PCBs.
M29W256GH70N6E Applications
- Automotive Systems: Utilized in engine management and infotainment systems where long-term reliability and high data integrity are required.
- Industrial Automation: Serves as a critical component in PLCs and CNC machines, offering the robust storage needed for complex operational codes and configurations.
- Consumer Electronics: Ideal for use in set-top boxes and gaming consoles, where extensive data storage and fast retrieval enhance user experience.
- Telecommunication Infrastructure: Applied in network routers and switches to store firmware and configuration data, enabling efficient and scalable network operations.
- Medical Devices: Supports storage of critical firmware in devices like imaging systems and patient monitors, ensuring reliable operation in critical healthcare settings.
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