M29F400FB55N3E2
- Mfr.Part #
- M29F400FB55N3E2
- Manufacturer
- Alliance Memory, Inc.
- Package / Case
- 48-TFSOP (0.724, 18.40mm Width)
- Datasheet
- Download
- Description
- IC FLASH 4MBIT PARALLEL 48TSOP
- Stock
- 512
- In Stock :
- 512
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- Manufacturer :
- Alliance Memory, Inc.
- Product Category :
- Memory
- Number of Functions :
- 1
- Voltage :
- 4.5V
- Number of Terminations :
- 48
- Power Supplies :
- 5V
- Memory Format :
- Flash
- Sector Size :
- 16K8K32K64K
- Memory Type :
- Non-Volatile
- Alternate Memory Width :
- 8
- Height Seated (Max) :
- 1.2mm
- Package / Case :
- 48-TFSOP (0.724, 18.40mm Width)
- Contact Plating :
- Tin
- RoHS Status :
- ROHS3 Compliant
- Pbfree Code :
- yes
- Voltage - Supply :
- 4.5V~5.5V
- Operating Temperature :
- -40°C~125°C TA
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Packaging :
- Tray
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Standby Current-Max :
- 0.00012A
- Sync/Async :
- ASYNCHRONOUS
- Toggle Bit :
- yes
- ECCN Code :
- EAR99
- Supply Voltage :
- 5V
- JESD-609 Code :
- e3
- Data Polling :
- yes
- Base Part Number :
- M29F400
- Screening Level :
- AEC-Q100
- Nominal Supply Current :
- 20mA
- Length :
- 18.4mm
- Density :
- 4 Mb
- Operating Supply Voltage :
- 5V
- Width :
- 12mm
- Memory Interface :
- Parallel
- HTS Code :
- 8542.32.00.51
- Number of Sectors/Size :
- 1217
- Access Time (Max) :
- 55 ns
- Organization :
- 256KX16
- Terminal Position :
- Dual
- Terminal Pitch :
- 0.5mm
- Command User Interface :
- yes
- Ready/Busy :
- yes
- Memory Width :
- 16
- Mounting Type :
- Surface Mount
- Memory Size :
- 4Mb 512K x 8 256K x 16
- Published :
- 2010
- Write Cycle Time - Word, Page :
- 55ns
- Number of Pins :
- 48
- Radiation Hardening :
- No
- Additional Feature :
- BOTTOM BOOT BLOCK
- Boot Block :
- BOTTOM
- Surface Mount :
- yes
- Pin Count :
- 48
- Common Flash Interface :
- yes
- Peak Reflow Temperature (Cel) :
- 260
- Datasheets
- M29F400FB55N3E2

Memory Alliance Memory, Inc. M29F400FB55N3E2 Overview
The Memory Alliance Memory, Inc. M29F400FB55N3E2 is a high-performance 4Mbit flash memory IC designed for a wide range of industrial and commercial applications. Engineered by Alliance Memory, Inc., a leader in memory solutions, this device features a parallel interface for high-speed data transfer and a 48-TSOP package for robust, reliable integration. Its compact size and significant storage capacity make it ideal for systems requiring a dependable, non-volatile memory solution. By integrating advanced memory technologies, the M29F400FB55N3E2 offers both durability and efficiency, suited for environments demanding consistent performance and long-term reliability.
M29F400FB55N3E2 Features
The M29F400FB55N3E2 flash memory chip includes several key features that make it a versatile choice for many applications. It operates over a standard voltage range and features a parallel interface for rapid read/write operations. Its 4Mbit capacity is partitioned into uniform block sizes, facilitating easier data management and access. Additionally, the IC's low power consumption and high endurance make it an optimal solution for devices requiring frequent data updates.
M29F400FB55N3E2 Applications
- Automotive Systems: Utilized in engine management systems and infotainment systems, where high reliability and fast access to non-volatile memory are crucial.
- Industrial Automation: Serves as data logging memory in complex industrial machines and control systems, ensuring robust performance even in harsh conditions.
- Consumer Electronics: Integrated into consumer devices such as set-top boxes and gaming consoles, where its speed and durability enhance user experience.
- Telecommunications: Used in network infrastructure to store firmware and configuration data, supporting quick recovery and updates.
- Security Systems: Applied in security and surveillance equipment, storing critical data that must be preserved reliably over long periods.
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