M29DW323DT70ZE6E
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- Mfr.Part #
- M29DW323DT70ZE6E
- Manufacturer
- Micron Technology
- Package / Case
- 48-TFBGA
- Datasheet
- Download
- Description
- IC FLASH 32MBIT PARALLEL 48TFBGA
- Stock
- 10,403
- In Stock ：
- 10,403
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Packaging :
- Tray
- Voltage :
- 2.7V
- Organization :
- 2MX16
- RoHS Status :
- ROHS3 Compliant
- Termination :
- SMD/SMT
- Nominal Supply Current :
- 10mA
- Command User Interface :
- yes
- Radiation Hardening :
- No
- Standby Current-Max :
- 0.0001A
- Length :
- 8mm
- Memory Width :
- 16
- Terminal Pitch :
- 0.8mm
- Alternate Memory Width :
- 8
- Package / Case :
- 48-TFBGA
- Mounting Type :
- Surface Mount
- Memory Interface :
- Parallel
- Surface Mount :
- yes
- Additional Feature :
- TOP BOOT BLOCK
- Number of Sectors/Size :
- 863
- Number of Terminations :
- 48
- Base Part Number :
- M29DW323
- Number of Functions :
- 1
- Supply Voltage :
- 3V
- Sector Size :
- 8K64K
- Ready/Busy :
- yes
- ECCN Code :
- 3A991.B.1.A
- Peak Reflow Temperature (Cel) :
- 260
- Memory Type :
- Non-Volatile
- HTS Code :
- 8542.32.00.51
- Pin Count :
- 48
- Terminal Position :
- BOTTOM
- Write Cycle Time - Word, Page :
- 70ns
- Access Time (Max) :
- 70 ns
- Pbfree Code :
- yes
- Power Supplies :
- 3/3.3V
- JESD-609 Code :
- e1
- Operating Temperature :
- -40°C~85°C TA
- Boot Block :
- Top
- REACH SVHC :
- No SVHC
- Data Polling :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Pins :
- 48
- Memory Format :
- Flash
- Height Seated (Max) :
- 1.2mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Common Flash Interface :
- yes
- Published :
- 2003
- Memory Size :
- 32Mb 4M x 8 2M x 16
- Toggle Bit :
- yes
- Sync/Async :
- ASYNCHRONOUS
- Width :
- 6mm
- Terminal Finish :
- TIN SILVER COPPER
- Density :
- 32 Mb
- Voltage - Supply :
- 2.7V~3.6V
- Datasheets
- M29DW323DT70ZE6E
Memory Micron Technology M29DW323DT70ZE6E Overview
The Memory Micron Technology M29DW323DT70ZE6E is an advanced IC FLASH that offers robust data storage solutions in a compact 48TFBGA package. Engineered by Micron Technology, a leader in integrated circuit technologies, this device boasts a substantial 32Mbit storage capacity and utilizes parallel interface technology for rapid data transfer and retrieval. This product is designed to meet the rigorous demands of modern electronic applications, offering durability and reliability for systems requiring high-volume, non-volatile memory. Its compact size and significant storage capabilities make it an ideal choice for developers and manufacturers aiming to enhance their systems with efficient and space-saving memory solutions.
M29DW323DT70ZE6E Features
The M29DW323DT70ZE6E comes packed with features that make it a versatile and efficient choice for a wide range of applications. It offers a 32Mbit memory size that ensures ample space for critical data storage. The parallel interface facilitates higher throughput and lower latency, enhancing overall system performance. Its 48TFBGA package is designed for optimal space utilization, making it suitable for compact systems that require large amounts of data storage without compromising on physical dimensions.
M29DW323DT70ZE6E Applications
- Consumer Electronics: Utilized in devices such as digital cameras and gaming consoles, where large, fast, and reliable memory is crucial for user experience.
- Automotive Systems: Employs in advanced driver-assistance systems (ADAS) for storing firmware and data logs that help in function and diagnostics.
- Industrial Automation: Applied in PLCs and industrial PCs where robust memory is needed to handle complex processes and environments.
- Telecommunications: Used in networking equipment like routers and switches, supporting the storage of firmware and configuration files necessary for device operations.
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