M29DW323DT70N6E

Manufacturer :

Micron Technology

Product Category :

Memory

Organization :

2MX16

Height Seated (Max) :

1.2mm

Terminal Finish :

MATTE TIN

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Additional Feature :

TOP BOOT BLOCK

Density :

32 Mb

HTS Code :

8542.32.00.51

Alternate Memory Width :

8

Packaging :

Tray

Memory Type :

Non-Volatile

ECCN Code :

3A991.B.1.A

Memory Width :

16

Operating Temperature :

-40°C~85°C TA

Sync/Async :

ASYNCHRONOUS

Sector Size :

8K64K

Number of Functions :

1

Boot Block :

Top

Toggle Bit :

yes

Data Polling :

yes

Terminal Pitch :

0.5mm

Termination :

SMD/SMT

Length :

18.4mm

Base Part Number :

M29DW323

JESD-609 Code :

e3

REACH SVHC :

No SVHC

Write Cycle Time - Word, Page :

70ns

Number of Terminations :

48

Factory Lead Time :

4 Weeks

Access Time (Max) :

70 ns

Voltage - Supply :

2.7V~3.6V

Voltage :

2.7V

Memory Interface :

Parallel

Power Supplies :

3/3.3V

Width :

12mm

Memory Size :

32Mb 4M x 8 2M x 16

Published :

2004

Supply Voltage :

3V

Surface Mount :

yes

Memory Format :

Flash

Time@Peak Reflow Temperature-Max (s) :

30

RoHS Status :

ROHS3 Compliant

Nominal Supply Current :

10mA

Common Flash Interface :

yes

Standby Current-Max :

0.0001A

Command User Interface :

yes

Terminal Position :

Dual

Mounting Type :

Surface Mount

Number of Sectors/Size :

863

Pin Count :

48

Radiation Hardening :

No

Package / Case :

48-TFSOP (0.724, 18.40mm Width)

Pbfree Code :

yes

Ready/Busy :

yes

Number of Pins :

48

Peak Reflow Temperature (Cel) :

260