M29DW323DB70ZE6E

Manufacturer :

Micron Technology

Product Category :

Memory

Memory Type :

Non-Volatile

HTS Code :

8542.32.00.51

Toggle Bit :

yes

Boot Block :

BOTTOM

Memory Interface :

Parallel

Nominal Supply Current :

10mA

Voltage :

2.7V

JESD-609 Code :

e1

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Width :

6mm

Radiation Hardening :

No

Published :

2004

RoHS Status :

ROHS3 Compliant

Density :

32 Mb

Mounting Type :

Surface Mount

Height Seated (Max) :

1.2mm

Common Flash Interface :

yes

Memory Size :

32Mb 4M x 8 2M x 16

Length :

8mm

Ready/Busy :

yes

REACH SVHC :

No SVHC

Time@Peak Reflow Temperature-Max (s) :

30

Memory Width :

16

Surface Mount :

yes

Terminal Position :

BOTTOM

Operating Temperature :

-40°C~85°C TA

Terminal Pitch :

0.8mm

Organization :

2MX16

Sector Size :

8K64K

Number of Functions :

1

Termination :

SMD/SMT

Base Part Number :

M29DW323

Power Supplies :

3/3.3V

Data Polling :

yes

Number of Terminations :

48

Supply Voltage :

3V

Package / Case :

48-TFBGA

Pbfree Code :

yes

Memory Format :

Flash

Packaging :

Tray

Number of Sectors/Size :

863

Peak Reflow Temperature (Cel) :

260

Standby Current-Max :

0.0001A

Access Time (Max) :

70 ns

ECCN Code :

3A991.B.1.A

Voltage - Supply :

2.7V~3.6V

Sync/Async :

ASYNCHRONOUS

Command User Interface :

yes

Additional Feature :

BOTTOM BOOT BLOCK

Pin Count :

48

Write Cycle Time - Word, Page :

70ns

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Alternate Memory Width :

8

Number of Pins :

48