M29DW323DB70ZE6E
- Mfr.Part #
- M29DW323DB70ZE6E
- Manufacturer
- Micron Technology
- Package / Case
- 48-TFBGA
- Datasheet
- Download
- Description
- IC FLASH 32MBIT PARALLEL 48TFBGA
- Stock
- 769
- In Stock :
- 769
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Sync/Async :
- ASYNCHRONOUS
- Number of Terminations :
- 48
- Radiation Hardening :
- No
- Common Flash Interface :
- yes
- Sector Size :
- 8K64K
- Access Time (Max) :
- 70 ns
- Length :
- 8mm
- Mounting Type :
- Surface Mount
- Standby Current-Max :
- 0.0001A
- Density :
- 32 Mb
- Operating Temperature :
- -40°C~85°C TA
- Height Seated (Max) :
- 1.2mm
- Voltage :
- 2.7V
- Number of Pins :
- 48
- Toggle Bit :
- yes
- Number of Sectors/Size :
- 863
- Write Cycle Time - Word, Page :
- 70ns
- Published :
- 2004
- Number of Functions :
- 1
- ECCN Code :
- 3A991.B.1.A
- Organization :
- 2MX16
- REACH SVHC :
- No SVHC
- Surface Mount :
- yes
- Boot Block :
- BOTTOM
- Terminal Pitch :
- 0.8mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Ready/Busy :
- yes
- Nominal Supply Current :
- 10mA
- Power Supplies :
- 3/3.3V
- Width :
- 6mm
- Memory Interface :
- Parallel
- Voltage - Supply :
- 2.7V~3.6V
- Base Part Number :
- M29DW323
- RoHS Status :
- ROHS3 Compliant
- Pin Count :
- 48
- HTS Code :
- 8542.32.00.51
- Supply Voltage :
- 3V
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 260
- Alternate Memory Width :
- 8
- Memory Size :
- 32Mb 4M x 8 2M x 16
- Additional Feature :
- BOTTOM BOOT BLOCK
- JESD-609 Code :
- e1
- Pbfree Code :
- yes
- Termination :
- SMD/SMT
- Memory Width :
- 16
- Command User Interface :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Data Polling :
- yes
- Package / Case :
- 48-TFBGA
- Terminal Position :
- BOTTOM
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Memory Type :
- Non-Volatile
- Memory Format :
- Flash
- Datasheets
- M29DW323DB70ZE6E

Memory Micron Technology M29DW323DB70ZE6E Overview
The Memory Micron Technology M29DW323DB70ZE6E is a high-performance 32Mbit FLASH memory device engineered for robust data storage and retrieval in complex applications. This memory module uses parallel interface technology, encapsulated in a compact 48TFBGA package, optimizing both space and speed in embedded systems. The M29DW323DB70ZE6E model is designed by Micron Technology, a leader in memory and storage solutions, ensuring reliability and high endurance for critical applications. With its significant storage capacity and fast access times, it is particularly suitable for applications requiring frequent write and erase cycles with a high level of data integrity.
M29DW323DB70ZE6E Features
- 32Mbit storage capacity
- Parallel interface for increased data transfer rates
- Compact 48TFBGA package
- Designed for high endurance and reliability
- Supports a wide range of operating temperatures
M29DW323DB70ZE6E Applications
- Consumer Electronics: Utilized in devices such as digital cameras and gaming consoles, where robust data storage for user settings and high-speed game data is crucial.
- Automotive Systems: Supports advanced automotive electronics, including infotainment systems and engine control units, requiring durable and fast memory solutions.
- Telecommunications: Critical for network infrastructure equipment, providing reliable data storage for firmware and configuration files in environments demanding high availability and longevity.
- Industrial Automation: Ideal for use in complex industrial machinery and robotics, where precise and rapid memory access is necessary for real-time process control and monitoring.
- Medical Devices: Supports the functionality of medical equipment like imaging systems and diagnostic tools that rely on high-integrity data storage for accurate results.
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