M29DW323DB70N6E

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Mfr.Part #
M29DW323DB70N6E
Manufacturer
Micron Technology
Package / Case
48-TFSOP (0.724, 18.40mm Width)
Datasheet
Download
Description
IC FLASH 32MBIT PARALLEL 48TSOP
Stock
17,845
In Stock :
17,845

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Width :
16
Base Part Number :
M29DW323
Number of Functions :
1
Nominal Supply Current :
10mA
REACH SVHC :
No SVHC
Width :
12mm
Radiation Hardening :
No
Additional Feature :
BOTTOM BOOT BLOCK
Terminal Pitch :
0.5mm
Boot Block :
BOTTOM
Power Supplies :
3/3.3V
Memory Format :
Flash
Voltage - Supply :
2.7V~3.6V
Sector Size :
8K64K
ECCN Code :
3A991.B.1.A
Organization :
2MX16
Supply Voltage :
3V
Alternate Memory Width :
8
Sync/Async :
ASYNCHRONOUS
Height Seated (Max) :
1.2mm
Density :
32 Mb
Memory Size :
32Mb 4M x 8 2M x 16
Toggle Bit :
yes
Packaging :
Tray
Number of Pins :
48
Data Polling :
yes
Common Flash Interface :
yes
Peak Reflow Temperature (Cel) :
260
Number of Terminations :
48
Pbfree Code :
yes
JESD-609 Code :
e3
Surface Mount :
yes
Ready/Busy :
yes
Termination :
SMD/SMT
RoHS Status :
ROHS3 Compliant
Operating Temperature :
-40°C~85°C TA
Command User Interface :
yes
HTS Code :
8542.32.00.51
Access Time (Max) :
70 ns
Memory Type :
Non-Volatile
Package / Case :
48-TFSOP (0.724, 18.40mm Width)
Memory Interface :
Parallel
Published :
2004
Voltage :
2.7V
Time@Peak Reflow Temperature-Max (s) :
30
Number of Sectors/Size :
863
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Pin Count :
48
Contact Plating :
Tin
Length :
18.4mm
Terminal Position :
Dual
Standby Current-Max :
0.0001A
Write Cycle Time - Word, Page :
70ns
Datasheets
M29DW323DB70N6E
Introducing Memory Micron Technology M29DW323DB70N6E from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:M29DW323, Number of Pins:48, Number of Terminations:48, Operating Temperature:-40°C~85°C TA, Package / Case:48-TFSOP (0.724, 18.40mm Width), Voltage:2.7V, Mounting Type:Surface Mount, M29DW323DB70N6E pinout, M29DW323DB70N6E datasheet PDF, M29DW323DB70N6E amp .Beyond Memory Micron Technology M29DW323DB70N6E ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology M29DW323DB70N6E


Memory Micron Technology M29DW323DB70N6E Overview

The Memory Micron Technology M29DW323DB70N6E represents a robust and reliable 32Mbit FLASH memory chip, delivered in a compact 48TSOP package. This integrated circuit is engineered by Micron Technology, a leader in advanced memory solutions, ensuring high-performance and durability. It is designed to support a wide range of data-intensive applications that require quick, non-volatile memory storage. Its parallel interface ensures high-speed data transfers, making it an excellent choice for sophisticated electronic environments requiring fast and efficient data handling capabilities.

M29DW323DB70N6E Features

This IC FLASH memory boasts a capacity of 32Mbit, packaged neatly in a 48TSOP configuration. Its parallel interface facilitates faster and more reliable data transfer compared to serial-interface memory chips. The device operates at efficient power levels, suitable for various electronic products and systems, ensuring both cost-effectiveness and energy efficiency. Its robust design is tailored to withstand the rigorous demands of continuous operation in a wide range of temperatures and environmental conditions.

M29DW323DB70N6E Applications

  • Consumer Electronics: Utilized in devices such as digital cameras and MP3 players, where robust and quick access to non-volatile memory is crucial for performance and user experience.
  • Automotive Applications: Serves in car infotainment systems, providing the necessary speed and reliability for managing system firmware and user data in real-time vehicular environments.
  • Industrial Control Systems: Applied in complex industrial machinery for firmware storage, ensuring smooth and reliable machine operation under varying operational conditions.
  • Telecommunication Infrastructure: Essential for storing firmware and other critical data in telecommunications equipment, aiding in the efficient management and operation of network systems.
  • Medical Devices: Used in various medical diagnostics equipment, where dependable and quick memory access is essential for accurate and swift patient diagnostics.
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