M28W640HCB70N6E

Manufacturer :

Micron Technology

Product Category :

Memory

Address Bus Width :

22b

Boot Block :

BOTTOM

Package / Case :

48-TFSOP (0.724, 18.40mm Width)

Memory Format :

Flash

Contact Plating :

Gold, Tin

Height Seated (Max) :

1.2mm

Surface Mount :

yes

Base Part Number :

M28W640

Power Supplies :

3/3.3V

Packaging :

Bulk

Memory Width :

16

JESD-609 Code :

e3

Length :

18.4mm

Word Size :

16b

Additional Feature :

BOTTOM BOOT BLOCK

Data Polling :

No

Terminal Pitch :

0.5mm

Pin Count :

48

Nominal Supply Current :

18mA

Density :

64 Mb

Radiation Hardening :

No

Voltage - Supply :

2.7V~3.6V

Number of Pins :

48

Pbfree Code :

yes

Memory Size :

64Mb 4M x 16

Number of Terminations :

48

Sync/Async :

ASYNCHRONOUS

Peak Reflow Temperature (Cel) :

260

Page Size :

4words

Terminal Position :

Dual

Common Flash Interface :

yes

Memory Type :

Non-Volatile

Mounting Type :

Surface Mount

Write Cycle Time - Word, Page :

70ns

Command User Interface :

yes

ECCN Code :

3A991.B.1.A

Standby Current-Max :

0.000005A

Memory Interface :

Parallel

Terminal Finish :

MATTE TIN

Voltage :

2.7V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Sector Size :

4K32K

Access Time (Max) :

70 ns

Operating Temperature :

-40°C~85°C TA

Supply Voltage :

3V

RoHS Status :

ROHS3 Compliant

Organization :

4MX16

Number of Sectors/Size :

8127

Number of Functions :

1

Toggle Bit :

No

Published :

2008

Time@Peak Reflow Temperature-Max (s) :

30

HTS Code :

8542.32.00.51