M1AFS600-2FGG256

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Mfr.Part #
M1AFS600-2FGG256
Manufacturer
Microchip Technology
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 119 I/O 256FBGA
Stock
47,407
In Stock :
47,407

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Manufacturer :
Microchip Technology
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Gates :
600000
RAM Size :
13.5kB
Total RAM Bits :
110592
Speed Grade :
2
Max Frequency :
1.47059GHz
Min Supply Voltage :
1.425V
Number of I/O :
119
Package / Case :
256-LBGA
Series :
Fusion®
Operating Supply Voltage :
1.5V
Mounting Type :
Surface Mount
Published :
2013
Length :
17mm
Max Operating Temperature :
70°C
Operating Temperature :
0°C~85°C TJ
Number of Registers :
13824
Weight :
400.011771mg
Factory Lead Time :
12 Weeks
Max Supply Voltage :
1.575V
Radiation Hardening :
No
Number of Pins :
256
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
RoHS Compliant
Width :
17mm
Mount :
Surface Mount
Min Operating Temperature :
0°C
Voltage - Supply :
1.425V~1.575V
Packaging :
Tray
Height :
1.2mm
Base Part Number :
M1AFS600
Supplier Device Package :
256-FPBGA (17x17)
Datasheets
M1AFS600-2FGG256
Introducing FPGAs (Field Programmable Gate Array) Microchip Technology M1AFS600-2FGG256 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Pins:256, Base Part Number:M1AFS600, M1AFS600-2FGG256 pinout, M1AFS600-2FGG256 datasheet PDF, M1AFS600-2FGG256 amp .Beyond FPGAs (Field Programmable Gate Array) Microchip Technology M1AFS600-2FGG256 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.5V V FPGAs Fusion® Series 256-LBGA

M1AFS600-2FGG256 Overview


The package that contains this software is called 256-LBGA. There are 119 I/Os for better data transfer. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.425V~1.575V battery. There are many types of FPGAs in the Fusion® series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 110592. If you are looking for related parts, you can use the base part number M1AFS600 as a starting point. For the program to work properly, the RAM si13.5kBe of this FPGA module must reach 13.5kB GB in order to ensure normal operation. In this case, 256 pins are used in the design. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.5V supply voltage. When this module is operated at its maximum operating temperature, it reaches 70°C. A higher operating temperature than 0°C is recommended. As a basic building block, fpga semiconductor consists of 600000 gates. In order to store and transfer data, a total of 13824 registers are used. This device is capable of supporting a maximum supply voltage of 1.575V. Using 1.425V as the minimum supply voltage, fpga semiconductor can operate. As fast as 1.47059GHz can be reached with this FPGA. The supplier of the device package is 256-FPBGA (17x17).

M1AFS600-2FGG256 Features


119 I/Os
Up to 110592 RAM bits
256 LABs/CLBs
70°C gates
13824 registers


M1AFS600-2FGG256 Applications


There are a lot of Microsemi Corporation
M1AFS600-2FGG256 FPGAs applications.


  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
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