M1A3PE1500-2FGG676

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Mfr.Part #
M1A3PE1500-2FGG676
Manufacturer
Microchip Technology
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 444 I/O 676FBGA
Stock
14,716
In Stock :
14,716

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Manufacturer :
Microchip Technology
Product Category :
FPGAs (Field Programmable Gate Array)
Mount :
Surface Mount
Height :
1.73mm
Total RAM Bits :
276480
Packaging :
Tray
Max Operating Temperature :
70°C
Weight :
400.011771mg
Number of I/O :
444
Min Supply Voltage :
1.425V
Published :
2014
Package / Case :
676-BGA
Radiation Hardening :
No
Supplier Device Package :
676-FBGA (27x27)
Speed Grade :
2
Factory Lead Time :
12 Weeks
Mounting Type :
Surface Mount
Number of Gates :
1500000
Number of Registers :
38400
Operating Temperature :
0°C~85°C TJ
Max Supply Voltage :
1.575V
Base Part Number :
M1A3PE1500
Operating Supply Voltage :
1.5V
Lifecycle Status :
IN PRODUCTION (Last Updated: 1 month ago)
Min Operating Temperature :
0°C
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
ProASIC3E
RAM Size :
33.8kB
Lead Free :
Lead Free
Voltage - Supply :
1.425V~1.575V
RoHS Status :
RoHS Compliant
Length :
27mm
Number of Pins :
676
Width :
27mm
Max Frequency :
310MHz
Introducing FPGAs (Field Programmable Gate Array) Microchip Technology M1A3PE1500-2FGG676 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BGA, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Base Part Number:M1A3PE1500, Number of Pins:676, M1A3PE1500-2FGG676 pinout, M1A3PE1500-2FGG676 datasheet PDF, M1A3PE1500-2FGG676 amp .Beyond FPGAs (Field Programmable Gate Array) Microchip Technology M1A3PE1500-2FGG676 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology M1A3PE1500-2FGG676


FPGAs Microchip Technology M1A3PE1500-2FGG676 Overview

Introducing the FPGAs Microchip Technology M1A3PE1500-2FGG676, a highly versatile and performance-oriented Field Programmable Gate Array (FPGA) designed by Microchip Technology. This component features a dense 676-ball fine-pitch ball grid array (FBGA) packaging, enabling robust physical integration while supporting a vast array of functionalities. The FPGA is engineered to meet the demanding requirements of high-speed and complex digital processing tasks, making it ideal for designers looking to leverage flexibility and high performance in their digital circuit designs. With its 444 I/O options, this product offers ample flexibility for interfacing with a variety of peripherals and other IC components, ensuring broad applicability across multiple industries.

M1A3PE1500-2FGG676 Features

The M1A3PE1500-2FGG676 FPGA by Microchip Technology boasts significant features that enhance its utility and performance in complex electronic designs. Key features include:

  • 444 I/O pins that provide extensive interfacing capabilities.
  • A compact 676FBGA package that optimizes board space without compromising functionality.
  • Robust support for digital processing and data management tasks.
These features make the M1A3PE1500-2FGG676 a reliable and effective solution for a variety of electronic applications, emphasizing its adaptability and capacity to handle intensive computational tasks.

M1A3PE1500-2FGG676 Applications

  • Telecommunications Equipment: Utilizes its high I/O pin count for processing complex algorithms required in modern communication infrastructures.
  • Automotive Systems: Employs advanced digital processing capabilities to manage and control automotive safety systems and infotainment.
  • Consumer Electronics: Supports high-performance processing needs in devices such as smartphones, tablets, and wearable technology.
  • Industrial Automation: Ideal for controlling machinery and processes that require precise and rapid processing of multiple input/output signals.
  • Medical Devices: Facilitates the handling of complex data algorithms essential in medical imaging and diagnostic equipment.
These applications demonstrate the M1A3PE1500-2FGG676's ability to adapt and function efficiently in various technical and demanding environments.
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