M1A3P600L-FG256
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- Mfr.Part #
- M1A3P600L-FG256
- Manufacturer
- Microsemi
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 177 I/O 256FBGA
- Stock
- 13,898
- In Stock ：
- 13,898
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- Manufacturer :
- Microsemi
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Lifecycle Status :
- LIMITED TIME BUY (Last Updated: 1 month ago)
- Number of I/O :
- 177
- Published :
- 2013
- Width :
- 17mm
- Total RAM Bits :
- 110592
- Operating Temperature :
- 0°C~85°C TJ
- Length :
- 17mm
- Series :
- ProASIC3L
- Operating Supply Voltage :
- 1.2V
- Max Operating Temperature :
- 70°C
- Packaging :
- Tray
- Base Part Number :
- M1A3P600L
- Max Frequency :
- 781.25MHz
- Number of Registers :
- 13824
- Radiation Hardening :
- No
- Max Supply Voltage :
- 1.26V
- Height :
- 1.2mm
- Min Supply Voltage :
- 1.14V
- Weight :
- 400.011771mg
- RAM Size :
- 13.5kB
- Supplier Device Package :
- 256-FPBGA (17x17)
- Number of Pins :
- 256
- Min Operating Temperature :
- 0°C
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mount :
- Surface Mount
- RoHS Status :
- Non-RoHS Compliant
- Number of Gates :
- 600000
- Voltage - Supply :
- 1.14V~1.575V
- Package / Case :
- 256-LBGA
- Datasheets
- M1A3P600L-FG256
FPGAs Microsemi M1A3P600L-FG256 Overview
The FPGAs Microsemi M1A3P600L-FG256 represents a pinnacle of programmable logic technology, engineered by Microsemi to deliver high-level performance suitable for a diverse range of sophisticated applications. This integrated circuit, encased in a compact 256FBGA package, is designed to cater to demanding environments where high I/O capabilities are essential. With 177 I/O pins, this FPGA is ideally suited for complex digital computations, data processing at high speeds, and multifunctional system integrations. The flexibility offered by this device makes it an essential component for designers looking to optimize their systems for maximum efficiency and reliability.
M1A3P600L-FG256 Features
This Microsemi FPGA is crafted with advanced features that support extensive adaptability and robust performance. Key features include a high-density integration capable of supporting complex algorithm computations and an efficient power management system that enhances device longevity and reliability under varying operational conditions. The 256FBGA packaging not only ensures a reduced footprint but also improves thermal management and electrical performance, making it an excellent choice for tightly packed system layouts.
M1A3P600L-FG256 Applications
- Telecommunications: Utilized in network infrastructure, the M1A3P600L-FG256 aids in processing and routing high volumes of data efficiently, enhancing communication reliability and speed.
- Automotive Systems: Integrates into safety and control systems, providing the computational power necessary to handle complex algorithms for real-time decision making.
- Industrial Automation: Powers programmable logic controllers and automation systems, enabling advanced manufacturing techniques and increased production line flexibility.
- Consumer Electronics: Applied in devices requiring high-speed signal processing, such as high-definition video processors, enhancing user experiences through improved device responsiveness.
- Aerospace and Defense: Critical in navigation and control systems, this FPGA offers the robustness needed for applications where failure is not an option, ensuring system integrity and safety.
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