M1A3P600-2FGG256
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- Mfr.Part #
- M1A3P600-2FGG256
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 177 I/O 256FBGA
- Stock
- 26,739
- In Stock ：
- 26,739
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- Manufacturer :
- Microchip Technology
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage - Supply :
- 1.425V~1.575V
- Radiation Hardening :
- No
- Packaging :
- Tray
- Min Supply Voltage :
- 1.425V
- Mount :
- Surface Mount
- Base Part Number :
- M1A3P600
- Operating Supply Voltage :
- 1.5V
- Series :
- ProASIC3
- Length :
- 17mm
- Supplier Device Package :
- 256-FPBGA (17x17)
- RAM Size :
- 13.5kB
- Operating Temperature :
- 0°C~85°C TJ
- Height :
- 1.2mm
- Total RAM Bits :
- 110592
- Mounting Type :
- Surface Mount
- Number of Pins :
- 256
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Number of Registers :
- 13824
- Package / Case :
- 256-LBGA
- Speed Grade :
- 2
- Weight :
- 400.011771mg
- Max Frequency :
- 310MHz
- RoHS Status :
- RoHS Compliant
- Width :
- 17mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Max Supply Voltage :
- 1.575V
- Number of Gates :
- 600000
- Factory Lead Time :
- 12 Weeks
- Max Operating Temperature :
- 70°C
- Min Operating Temperature :
- 0°C
- Number of I/O :
- 177
- Datasheets
- M1A3P600-2FGG256
FPGAs Microchip Technology M1A3P600-2FGG256 Overview
The FPGAs Microchip Technology M1A3P600-2FGG256 is a high-performance, field-programmable gate array designed for advanced electronic applications requiring dynamic reconfigurability and robust I/O capabilities. This IC FPGA, housed in a compact 256FBGA package, features 177 I/O pins, making it an ideal choice for developers looking to integrate flexible logic solutions into their designs. The versatility of the M1A3P600-2FGG256 enables integration into a myriad of industrial and commercial applications, offering not only programmability but also scalability and efficiency critical for modern electronic environments.
M1A3P600-2FGG256 Features
The M1A3P600-2FGG256 from Microchip Technology comes packed with features that stand out in the realm of programmable logic devices. It supports a wide range of design implementations thanks to its ample I/O options and its small form factor BGA packaging, which facilitates dense board placement and complex circuit designs. Additionally, the device provides robust performance suitable for high-speed signal processing and data manipulation, essential for demanding applications.
M1A3P600-2FGG256 Applications
- Telecommunications: Utilized in communication equipment for signal processing, routing, and data handling to enhance bandwidth and reduce latency.
- Automotive: Integrated into automotive systems for controlling and managing advanced driver-assistance systems (ADAS), improving vehicle safety and performance.
- Consumer Electronics: Employed in consumer electronics such as smart home devices and high-performance gaming consoles to manage complex user interfaces and connectivity solutions.
- Industrial Automation: Critical in industrial automation systems for process control, monitoring, and machine vision applications, enabling more efficient manufacturing processes.
- Aerospace: Applied in aerospace applications for control systems, navigation, and communication systems to ensure reliability and safety in harsh environments.
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