M1A3P250-1FG144

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Mfr.Part #
M1A3P250-1FG144
Manufacturer
Microchip Technology
Package / Case
144-LBGA
Datasheet
Download
Description
IC FPGA 97 I/O 144FBGA
Stock
9,304
In Stock :
9,304

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Manufacturer :
Microchip Technology
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
Non-RoHS Compliant
Packaging :
Tray
Width :
13mm
Lifecycle Status :
IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time :
12 Weeks
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Max Operating Temperature :
70°C
Radiation Hardening :
No
Height :
1.05mm
Operating Temperature :
0°C~85°C TJ
Number of Gates :
250000
Speed Grade :
1
Series :
ProASIC3
Operating Supply Voltage :
1.5V
Voltage - Supply :
1.425V~1.575V
Frequency :
272MHz
Mount :
Surface Mount
Number of I/O :
97
Max Frequency :
272MHz
Base Part Number :
M1A3P250
Min Supply Voltage :
1.425V
Published :
2012
Total RAM Bits :
36864
Mounting Type :
Surface Mount
RAM Size :
4.5kB
Min Operating Temperature :
0°C
Package / Case :
144-LBGA
Weight :
400.011771mg
Supplier Device Package :
144-FPBGA (13x13)
Max Supply Voltage :
1.575V
Number of Pins :
144
Length :
13mm
Number of Registers :
6144
Datasheets
M1A3P250-1FG144
Introducing FPGAs (Field Programmable Gate Array) Microchip Technology M1A3P250-1FG144 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Base Part Number:M1A3P250, Mounting Type:Surface Mount, Package / Case:144-LBGA, Number of Pins:144, M1A3P250-1FG144 pinout, M1A3P250-1FG144 datasheet PDF, M1A3P250-1FG144 amp .Beyond FPGAs (Field Programmable Gate Array) Microchip Technology M1A3P250-1FG144 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.5V V FPGAs ProASIC3 Series 272MHz MHz 144-LBGA

M1A3P250-1FG144 Overview


In the package 144-LBGA, this product is provided. A total of 97 I/Os are programmed to ensure a more coherent data transfer. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.425V~1.575V, this device operates with ease. This is a type of FPGA that is part of the ProASIC3 series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 36864 bfpga electronics s of RAM. M1A3P250 is the base part number that can be used to identify related parts. The RAM si4.5kBe of this FPGA module reaches 4.5kB so as to guarantee the normal operation of the program during operation. The device has 144 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.5V, designers can take advantage of its flexibility to the fullest extent. This module can reach a maximum operating temperature of 70°C when operating at its maximum power. Fpga electronics is necessary to maintain an operating temperature higher than 0°C. A basic building block for this type of building block consists of 250000 gates. The structure of the registers used to store and transfer data consists of 6144 registers. The system operates at a frequency of 272MHz in order to achieve maximum efficiency. The maximum supply voltage it can take is 1.575V. The device can function at a minimum voltage of 1.425V. In fact, this FPGA is capable of reaching a speed of 272MHz. As a supplier, 144-FPBGA (13x13) is responsible for the package of its devices.

M1A3P250-1FG144 Features


97 I/Os
Up to 36864 RAM bits
144 LABs/CLBs
70°C gates
6144 registers
Operating from a frequency of 272MHz


M1A3P250-1FG144 Applications


There are a lot of Microsemi Corporation
M1A3P250-1FG144 FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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