LPC43S70FET100E

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Mfr.Part #
LPC43S70FET100E
Manufacturer
NXP Semiconductors
Package / Case
100-TFBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 100TFBGA
Stock
246
In Stock :
246

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Clock Frequency :
25MHz
Packaging :
Tray
Oscillator Type :
Internal
Pin Count :
100
Terminal Pitch :
0.8mm
Peak Reflow Temperature (Cel) :
260
Terminal Form :
Ball
Supply Voltage-Max (Vsup) :
3.6V
Core Size :
32-Bit Dual-Core
Mounting Type :
Surface Mount
Address Bus Width :
14
Voltage - Supply (Vcc/Vdd) :
2.2V~3.6V
Core Processor :
ARM® Cortex®-M4/M0
Supply Voltage-Min (Vsup) :
2.2V
Package / Case :
100-TFBGA
Program Memory Type :
ROMless
Speed :
204MHz
Surface Mount :
yes
DMA Channels :
yes
Peripherals :
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Factory Lead Time :
12 Weeks
External Data Bus Width :
8
RAM Size :
282K x 8
Width :
9mm
Terminal Position :
BOTTOM
PWM Channels :
yes
Data Converter :
A/D 16x10b, 6x12b; D/A 1x10b
Number of I/O :
49
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Series :
LPC43xx
Length :
9mm
Operating Temperature :
-40°C~85°C TA
Published :
2010
RoHS Status :
ROHS3 Compliant
Supply Voltage :
3.3V
Has ADC :
yes
Bit Size :
32
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Number of Terminations :
100
Datasheets
LPC43S70FET100E
Introducing Microcontrollers NXP Semiconductors LPC43S70FET100E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:100-TFBGA, Operating Temperature:-40°C~85°C TA, Number of Terminations:100, LPC43S70FET100E pinout, LPC43S70FET100E datasheet PDF, LPC43S70FET100E amp .Beyond Microcontrollers NXP Semiconductors LPC43S70FET100E ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC43S70FET100E


Microcontrollers NXP Semiconductors LPC43S70FET100E Overview

The Microcontrollers NXP Semiconductors LPC43S70FET100E is a highly versatile and robust microcontroller unit (MCU) designed for sophisticated applications that demand high performance, connectivity, and real-time capabilities. As a ROM-less MCU in the 100TFBGA package, it provides exceptional flexibility for system designers to integrate customized memory solutions according to their specific application requirements. The integration of advanced peripherals, high-speed interfaces, and the capability to handle complex control algorithms makes this microcontroller an ideal choice for engineers looking to develop advanced industrial, automotive, and communication systems. By employing the LPC43S70FET100E, businesses can significantly enhance the functionality, reliability, and efficiency of their systems, encouraging bulk purchases for large-scale deployments.

LPC43S70FET100E Features

The LPC43S70FET100E microcontroller from NXP Semiconductors stands out with its ARM Cortex-M4 core, offering high computing power suitable for multitasking environments. Additional features include:

  • Dual-core architecture with Cortex-M0 co-processor, enabling efficient handling of both high-level application code and real-time system management tasks.
  • Advanced connectivity options including high-speed USB, CAN, and Ethernet, facilitating versatile system integrations and data communications.
  • Enhanced security features to ensure data integrity and secure communications, crucial for IoT and connected devices.
  • A wide range of digital and analog peripherals that allow for customized and flexible system designs.
  • Scalable from ROM-less configurations, allowing designers to choose optimal memory solutions tailored to their application needs.

LPC43S70FET100E Applications

  • Industrial Automation: The LPC43S70FET100E can manage complex sensor networks and automate control processes with its robust processing capabilities and multiple I/O options.
  • Automotive Systems: Used in vehicle control systems where multiple tasks such as sensor data processing and real-time system feedback are essential.
  • Home Automation Systems: Integrates seamlessly into smart home platforms, enabling sophisticated management of lighting, security, and HVAC systems.
  • Medical Devices: Suitable for medical monitoring systems that require high reliability and real-time data processing capabilities.
  • Communication Infrastructure: Helps in the development of communication equipment such as routers and switches that demand high-speed data transfer and processing.
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