LPC43S50FET180E

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Mfr.Part #
LPC43S50FET180E
Manufacturer
NXP Semiconductors
Package / Case
180-TFBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 180TFBGA
Stock
167
In Stock :
167

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Package / Case :
180-TFBGA
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Factory Lead Time :
12 Weeks
Packaging :
Tray
Number of I/O :
118
Core Size :
32-Bit Dual-Core
RAM Size :
264K x 8
Published :
2010
Oscillator Type :
Internal
Peripherals :
Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Pin Count :
180
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Core Processor :
ARM® Cortex®-M4/M0
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Series :
LPC43xx
Program Memory Type :
ROMless
Data Converter :
A/D 8x10b; D/A 1x10b
Connectivity :
I²C, IrDA, LINbus, SPI, UART/USART
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Voltage - Supply (Vcc/Vdd) :
2.2V~3.6V
RoHS Status :
ROHS3 Compliant
Operating Temperature :
-40°C~85°C TA
Speed :
204MHz
Datasheets
LPC43S50FET180E
Introducing Microcontrollers NXP Semiconductors LPC43S50FET180E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:180-TFBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, LPC43S50FET180E pinout, LPC43S50FET180E datasheet PDF, LPC43S50FET180E amp .Beyond Microcontrollers NXP Semiconductors LPC43S50FET180E ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC43S50FET180E


Microcontrollers NXP Semiconductors LPC43S50FET180E Overview

The LPC43S50FET180E from NXP Semiconductors is a high-performance microcontroller unit (MCU) that integrates advanced features suitable for a range of sophisticated applications. This MCU, part of the highly capable LPC family, is designed to meet the demanding needs of modern embedded systems. It features a 32-bit ARM Cortex-M4 processor, offering robust computational power and flexibility. As a ROMless device in a compact 180TFBGA package, it provides designers the freedom to specify external memory according to their system requirements, thus optimizing the system's performance and cost. The Microcontrollers NXP Semiconductors LPC43S50FET180E excels in applications requiring high-speed data processing, complex algorithms, and real-time execution, making it a premier choice for high-end embedded applications.

LPC43S50FET180E Features

This advanced MCU supports dual-core processing capabilities, integrating both ARM Cortex-M4 and Cortex-M0 processors. This dual-core architecture enables simultaneous processing of high-level application code and real-time control tasks, significantly enhancing system efficiency and reliability. Additional features include extensive I/O capabilities, high-speed USB ports, and advanced peripheral support for improved connectivity and data management. Moreover, its flexible memory interface supports a variety of external memory configurations, allowing for tailored solutions that meet specific application needs.

LPC43S50FET180E Applications

  • Industrial Automation: The LPC43S50FET180E can be used to manage complex control systems in industrial settings, providing the processing power needed for real-time motor control, sensor data analysis, and actuator management.
  • Automotive Systems: In automotive applications, this MCU delivers the necessary robustness for handling automotive-grade communication protocols and real-time system monitoring, enhancing vehicle safety and performance.
  • Consumer Electronics: Ideal for high-performance consumer electronics, such as gaming consoles and smart home devices, where its high data processing capabilities allow for enhanced user interfaces and connectivity features.
  • Medical Devices: Suitable for medical applications where precision and reliability are critical. It supports devices requiring complex data processing, such as imaging systems and portable medical monitoring devices.
  • Communication Infrastructure: It serves well in communication systems, offering the capabilities necessary for managing data-intensive tasks like wireless base stations and network routers efficiently.
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