LPC4330FET256,551

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Mfr.Part #
LPC4330FET256,551
Manufacturer
NXP Semiconductors
Package / Case
256-LBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 256LBGA
Stock
1
In Stock :
1

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Data Converter :
A/D 8x10b; D/A 1x10b
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Package / Case :
256-LBGA
JESD-609 Code :
e1
Program Memory Type :
ROMless
Number of Terminations :
256
Oscillator Type :
Internal
Terminal Pitch :
1mm
Length :
17mm
Has ADC :
yes
HTS Code :
8542.31.00.01
Published :
2010
Power Supplies :
2.5/3.3V
Packaging :
Tray
Operating Temperature :
-40°C~85°C TA
Factory Lead Time :
12 Weeks
Height Seated (Max) :
1.55mm
Core Size :
32-Bit Dual-Core
Terminal Position :
BOTTOM
Core Processor :
ARM® Cortex®-M4/M0
Number of I/O :
164
Speed :
204MHz
Bit Size :
32
Peak Reflow Temperature (Cel) :
260
Supply Voltage-Max (Vsup) :
3.6V
Supply Voltage :
3.3V
Surface Mount :
yes
ROM (words) :
0
ROM Programmability :
Flash
Width :
17mm
Address Bus Width :
24
PWM Channels :
yes
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Base Part Number :
LPC4330
Voltage - Supply (Vcc/Vdd) :
2.2V~3.6V
JESD-30 Code :
S-PBGA-B256
Qualification Status :
Not Qualified
Series :
LPC43xx
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Clock Frequency :
25MHz
Connectivity :
I²C, IrDA, LINbus, SPI, UART/USART
Terminal Form :
Ball
DMA Channels :
yes
Peripherals :
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supply Voltage-Min (Vsup) :
2.2V
Pin Count :
256
ECCN Code :
EAR99
RAM Size :
264K x 8
DAC Channels :
yes
External Data Bus Width :
32
CPU Family :
CORTEX-M4
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Datasheets
LPC4330FET256,551
Introducing Microcontrollers NXP Semiconductors LPC4330FET256,551 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Number of Terminations:256, Operating Temperature:-40°C~85°C TA, Base Part Number:LPC4330, Mounting Type:Surface Mount, LPC4330FET256,551 pinout, LPC4330FET256,551 datasheet PDF, LPC4330FET256,551 amp .Beyond Microcontrollers NXP Semiconductors LPC4330FET256,551 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC4330FET256,551


Microcontrollers NXP Semiconductors LPC4330FET256,551 Overview

The LPC4330FET256,551 by NXP Semiconductors represents a robust class of microcontrollers designed to tackle demanding embedded applications. This device integrates a powerful dual-core architecture, consisting of an ARM Cortex-M4 and a Cortex-M0 processor. The dual-core setup not only enhances performance through efficient task sharing and processing but also provides flexibility in power management and system design. With its ROM-less configuration in a 256LBGA package, it offers significant versatility for developers aiming to design high-performance, scalable embedded systems with a focus on real-time capabilities.

LPC4330FET256,551 Features

The LPC4330FET256,551 microcontroller is packed with features that cater to a wide range of technical requirements:

  • Advanced dual-core architecture featuring ARM Cortex-M4 and Cortex-M0 processors.
  • High-speed interfaces including USB, SPI, UART, and I2C for comprehensive external communication.
  • A ROM-less configuration, allowing for flexible memory usage and application-specific customization.
  • 256-ball low-profile BGA (LBGA) package for reduced space footprint in complex PCB designs.
  • Enhanced graphics support and digital signal processing capabilities suitable for multimedia applications.

LPC4330FET256,551 Applications

  • Industrial Automation: Ideal for managing complex machinery with its dual-core processing power, enhancing operational efficiency and reliability.
  • Consumer Electronics: Supports high-level multimedia functionalities required in smart home devices and portable electronics.
  • Automotive Applications: Robust enough for automotive-grade applications requiring fast real-time processing and connectivity options.
  • Communication Systems: Offers the necessary interfaces and processing capability for handling data-intensive communication tasks.
  • Medical Devices: Reliable and powerful for critical medical device operations, ensuring patient safety and device efficacy.
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