LPC3143FET180,551

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Mfr.Part #
LPC3143FET180,551
Manufacturer
NXP Semiconductors
Package / Case
180-TFBGA
Datasheet
Download
Description
IC MCU 16/32BIT ROMLESS 180TFBGA
Stock
4,030
In Stock :
4,030

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Voltage - Supply (Vcc/Vdd) :
1.1V~3.6V
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Height Seated (Max) :
1.2mm
JESD-30 Code :
S-PBGA-B180
Clock Frequency :
25MHz
Supply Voltage-Max (Vsup) :
1.3V
Number of I/O :
20
Speed :
270MHz
PWM Channels :
yes
Core Processor :
ARM926EJ-S
Series :
LPC3100
Published :
2009
Supply Voltage :
1.2V
JESD-609 Code :
e1
Has ADC :
yes
Length :
12mm
Packaging :
Tray
Pin Count :
180
Oscillator Type :
External
Terminal Position :
BOTTOM
RAM Size :
192K x 8
Terminal Form :
Ball
Number of Terminations :
180
Width :
12mm
Connectivity :
EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
ROM Programmability :
Flash
Factory Lead Time :
12 Weeks
Peripherals :
DMA, I2S, LCD, PWM, WDT
Core Size :
16/32-Bit
Data Converter :
A/D 4x10b
ROM (words) :
0
Terminal Pitch :
0.8mm
Bit Size :
32
DAC Channels :
No
Base Part Number :
LPC314*
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Mounting Type :
Surface Mount
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Supply Voltage-Min (Vsup) :
1.1V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Surface Mount :
yes
DMA Channels :
yes
Qualification Status :
Not Qualified
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Operating Temperature :
-40°C~85°C TA
RoHS Status :
ROHS3 Compliant
Package / Case :
180-TFBGA
Program Memory Type :
ROMless
Power Supplies :
1.21.8/3.3V
Datasheets
LPC3143FET180,551
Introducing Microcontrollers NXP Semiconductors LPC3143FET180,551 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:180, Base Part Number:LPC314*, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Package / Case:180-TFBGA, LPC3143FET180,551 pinout, LPC3143FET180,551 datasheet PDF, LPC3143FET180,551 amp .Beyond Microcontrollers NXP Semiconductors LPC3143FET180,551 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC3143FET180,551


Microcontrollers NXP Semiconductors LPC3143FET180,551 Overview

The Microcontrollers NXP Semiconductors LPC3143FET180,551 represents a high-performance, ROM-less microcontroller unit (MCU) tailored for versatile applications that require a 16/32-bit architecture. Manufactured by NXP Semiconductors, this MCU is housed in a compact 180TFBGA package, making it ideal for space-constrained applications. Its ROM-less design allows for flexibility in system design, enabling designers to tailor memory according to specific application needs. This product stands out for its ability to support complex computing tasks while maintaining power efficiency, making it an optimal choice for developers looking to harness robust processing capabilities in their products.

LPC3143FET180,551 Features

The LPC3143FET180,551 microcontroller offers a dual-core architecture that combines high performance with efficient power management. It includes multiple communication interfaces such as USB, SPI, UART, and I2C, facilitating extensive connectivity options. The MCU also supports a wide range of digital peripherals, enhancing its adaptability to different electronic components and systems. Its advanced interrupt handling capabilities ensure rapid response times and reliable performance in real-time applications.

LPC3143FET180,551 Applications

  • Industrial Automation: Utilizes its robust processing power and multiple I/O interfaces to manage complex machinery control and automation systems.
  • Consumer Electronics: Ideal for powering smart home devices, including advanced IoT solutions, where efficient data handling and connectivity are required.
  • Medical Devices: Supports the development of medical monitoring systems, leveraging its ability to process and analyze critical data in real-time.
  • Automotive Systems: Can be integrated into automotive applications for vehicle monitoring systems and advanced driver-assistance systems (ADAS) where reliability and performance are critical.
  • Communication Infrastructure: Provides the necessary computation and connectivity for communication equipment, including routers and network switches.
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