LPC3143FET180,551
- Mfr.Part #
- LPC3143FET180,551
- Manufacturer
- NXP Semiconductors
- Package / Case
- 180-TFBGA
- Datasheet
- Download
- Description
- IC MCU 16/32BIT ROMLESS 180TFBGA
- Stock
- 4,030
- In Stock :
- 4,030
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- Microcontrollers
- Voltage - Supply (Vcc/Vdd) :
- 1.1V~3.6V
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Height Seated (Max) :
- 1.2mm
- JESD-30 Code :
- S-PBGA-B180
- Clock Frequency :
- 25MHz
- Supply Voltage-Max (Vsup) :
- 1.3V
- Number of I/O :
- 20
- Speed :
- 270MHz
- PWM Channels :
- yes
- Core Processor :
- ARM926EJ-S
- Series :
- LPC3100
- Published :
- 2009
- Supply Voltage :
- 1.2V
- JESD-609 Code :
- e1
- Has ADC :
- yes
- Length :
- 12mm
- Packaging :
- Tray
- Pin Count :
- 180
- Oscillator Type :
- External
- Terminal Position :
- BOTTOM
- RAM Size :
- 192K x 8
- Terminal Form :
- Ball
- Number of Terminations :
- 180
- Width :
- 12mm
- Connectivity :
- EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
- ROM Programmability :
- Flash
- Factory Lead Time :
- 12 Weeks
- Peripherals :
- DMA, I2S, LCD, PWM, WDT
- Core Size :
- 16/32-Bit
- Data Converter :
- A/D 4x10b
- ROM (words) :
- 0
- Terminal Pitch :
- 0.8mm
- Bit Size :
- 32
- DAC Channels :
- No
- Base Part Number :
- LPC314*
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Mounting Type :
- Surface Mount
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER, RISC
- Supply Voltage-Min (Vsup) :
- 1.1V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Surface Mount :
- yes
- DMA Channels :
- yes
- Qualification Status :
- Not Qualified
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Operating Temperature :
- -40°C~85°C TA
- RoHS Status :
- ROHS3 Compliant
- Package / Case :
- 180-TFBGA
- Program Memory Type :
- ROMless
- Power Supplies :
- 1.21.8/3.3V
- Datasheets
- LPC3143FET180,551

Microcontrollers NXP Semiconductors LPC3143FET180,551 Overview
The Microcontrollers NXP Semiconductors LPC3143FET180,551 represents a high-performance, ROM-less microcontroller unit (MCU) tailored for versatile applications that require a 16/32-bit architecture. Manufactured by NXP Semiconductors, this MCU is housed in a compact 180TFBGA package, making it ideal for space-constrained applications. Its ROM-less design allows for flexibility in system design, enabling designers to tailor memory according to specific application needs. This product stands out for its ability to support complex computing tasks while maintaining power efficiency, making it an optimal choice for developers looking to harness robust processing capabilities in their products.
LPC3143FET180,551 Features
The LPC3143FET180,551 microcontroller offers a dual-core architecture that combines high performance with efficient power management. It includes multiple communication interfaces such as USB, SPI, UART, and I2C, facilitating extensive connectivity options. The MCU also supports a wide range of digital peripherals, enhancing its adaptability to different electronic components and systems. Its advanced interrupt handling capabilities ensure rapid response times and reliable performance in real-time applications.
LPC3143FET180,551 Applications
- Industrial Automation: Utilizes its robust processing power and multiple I/O interfaces to manage complex machinery control and automation systems.
- Consumer Electronics: Ideal for powering smart home devices, including advanced IoT solutions, where efficient data handling and connectivity are required.
- Medical Devices: Supports the development of medical monitoring systems, leveraging its ability to process and analyze critical data in real-time.
- Automotive Systems: Can be integrated into automotive applications for vehicle monitoring systems and advanced driver-assistance systems (ADAS) where reliability and performance are critical.
- Communication Infrastructure: Provides the necessary computation and connectivity for communication equipment, including routers and network switches.
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