LPC2925FBD100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Package / Case :

100-LQFP

Mounting Type :

Surface Mount

RAM Size :

40K x 8

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Published :

2010

Has ADC :

yes

JESD-609 Code :

e3

Program Memory Size :

512KB 512K x 8

Core Processor :

ARM9®

Data Converter :

A/D 16x8b

Supply Voltage-Min (Vsup) :

1.71V

Source Url Status Check Date :

2013-06-14 00:00:00

Number of Terminations :

100

Clock Frequency :

125MHz

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Speed :

125MHz

Terminal Finish :

Tin (Sn)

ROM (words) :

524288

Number of I/O :

60

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

DMA Channels :

yes

Height Seated (Max) :

1.6mm

DAC Channels :

No

Length :

14mm

RoHS Status :

ROHS3 Compliant

Packaging :

Tray

Qualification Status :

Not Qualified

EEPROM Size :

16K x 8

Connectivity :

CANbus, I2C, LINbus, SPI, UART/USART, USB

PWM Channels :

yes

Surface Mount :

yes

Core Size :

16/32-Bit

JESD-30 Code :

S-PQFP-G100

Terminal Form :

Gull wing

Series :

LPC2900

Program Memory Type :

Flash

Bit Size :

32

Oscillator Type :

Internal

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Base Part Number :

LPC292*

Terminal Pitch :

0.5mm

Supply Voltage-Max (Vsup) :

1.89V

Factory Lead Time :

12 Weeks

Peripherals :

DMA, POR, PWM, WDT

Power Supplies :

1.83/3.3V

Width :

14mm

Supply Voltage :

1.8V

Terminal Position :

QUAD

Operating Temperature :

-40°C~85°C TA

Pin Count :

100