LPC2367FBD100,551
- Mfr.Part #
- LPC2367FBD100,551
- Manufacturer
- NXP Semiconductors
- Package / Case
- 100-LQFP
- Datasheet
- Download
- Description
- IC MCU 16/32B 512KB FLSH 100LQFP
- Stock
- 76
- In Stock :
- 76
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- Microcontrollers
- Core Processor :
- ARM7®
- Series :
- LPC2300
- Peak Reflow Temperature (Cel) :
- 260
- Factory Lead Time :
- 12 Weeks
- JESD-30 Code :
- S-PQFP-G100
- Peripherals :
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Supply Current-Max :
- 100mA
- Connectivity :
- Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER, RISC
- Supply Voltage :
- 3.3V
- Terminal Position :
- QUAD
- Clock Frequency :
- 25MHz
- ROM (words) :
- 524288
- Supply Voltage-Max (Vsup) :
- 3.6V
- Terminal Pitch :
- 0.5mm
- RoHS Status :
- ROHS3 Compliant
- Bit Size :
- 32
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of I/O :
- 70
- Width :
- 14mm
- HTS Code :
- 8542.31.00.01
- Data Converter :
- A/D 6x10b; D/A 1x10b
- Oscillator Type :
- Internal
- External Data Bus Width :
- 16
- JESD-609 Code :
- e3
- DAC Channels :
- yes
- Length :
- 14mm
- Terminal Finish :
- Tin (Sn)
- Terminal Form :
- Gull wing
- Height Seated (Max) :
- 1.6mm
- Packaging :
- Tray
- Pin Count :
- 100
- Mounting Type :
- Surface Mount
- Program Memory Size :
- 512KB 512K x 8
- Surface Mount :
- yes
- Package / Case :
- 100-LQFP
- Base Part Number :
- LPC2367
- ECCN Code :
- EAR99
- RAM Size :
- 58K x 8
- Supply Voltage-Min (Vsup) :
- 3V
- Published :
- 2003
- Operating Temperature :
- -40°C~85°C TA
- Power Supplies :
- 3.3V
- Program Memory Type :
- Flash
- Speed :
- 72MHz
- PWM Channels :
- yes
- Voltage - Supply (Vcc/Vdd) :
- 3V~3.6V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Core Size :
- 16/32-Bit
- Number of Terminations :
- 100
- DMA Channels :
- yes
- Has ADC :
- yes
- Qualification Status :
- Not Qualified
- Datasheets
- LPC2367FBD100,551

Microcontrollers NXP Semiconductors LPC2367FBD100,551 Overview
Introducing the LPC2367FBD100,551, a robust microcontroller from NXP Semiconductors designed for demanding applications that require a high level of integration and performance. This microcontroller combines a versatile 16/32-bit ARM7TDMI-S core with a generous 512 KB of flash memory, housed in a compact 100-LQFP package. It is tailored to meet the complex processing needs of modern embedded systems while maintaining cost-effectiveness and power efficiency. The Microcontrollers NXP Semiconductors LPC2367FBD100,551 is an ideal choice for developers looking to push the boundaries of what's possible in their applications, offering extensive communication features and robust I/O capabilities.
LPC2367FBD100,551 Features
This microcontroller offers several advanced features, including a wide range of integrated peripherals which enhance its functionality and flexibility. Key features include multiple serial interfaces such as UARTs, SPI, I2C, and USB 2.0 Full-Speed, making it highly adaptable to communication-intensive applications. Additionally, it supports both real-time and more complex operating systems, is equipped with multiple timers and an analog-to-digital converter (ADC), enhancing its utility in processing varied data inputs.
LPC2367FBD100,551 Applications
- Industrial Control Systems: Utilizes its robust I/O capabilities and real-time performance to manage and monitor automated processes.
- Medical Devices: Supports complex algorithms needed for monitoring devices, thanks to its high memory capacity and efficient processing power.
- Automotive: Can be integrated into vehicle control systems, leveraging its multiple communication interfaces to ensure seamless operation and connectivity.
- Home Automation: Ideal for smart home devices, using its connectivity features to interact with other home automation systems and provide user-friendly controls.
- Communication Infrastructure: Supports the demanding requirements of communication systems with its extensive serial interfaces and USB connectivity.
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