LPC2365FBD100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Peak Reflow Temperature (Cel) :

260

Peripherals :

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

DAC Channels :

yes

Supply Current-Max :

100mA

Operating Temperature :

-40°C~85°C TA

Core Size :

16/32-Bit

JESD-30 Code :

S-PQFP-G100

Terminal Finish :

Tin (Sn)

Voltage - Supply (Vcc/Vdd) :

3V~3.6V

Program Memory Type :

Flash

Width :

14mm

Pin Count :

100

JESD-609 Code :

e3

Packaging :

Tray

Number of Terminations :

100

Data Converter :

A/D 6x10b; D/A 1x10b

Surface Mount :

yes

Oscillator Type :

Internal

Program Memory Size :

256KB 256K x 8

Published :

2003

RoHS Status :

ROHS3 Compliant

Series :

LPC2300

Length :

14mm

Connectivity :

Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Supply Voltage-Max (Vsup) :

3.6V

Bit Size :

32

Speed :

72MHz

PWM Channels :

yes

Terminal Form :

Gull wing

Base Part Number :

LPC2365

Power Supplies :

3.3V

Qualification Status :

Not Qualified

Clock Frequency :

25MHz

Terminal Pitch :

0.5mm

ROM (words) :

262144

Mounting Type :

Surface Mount

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Terminal Position :

QUAD

Core Processor :

ARM7®

Height Seated (Max) :

1.6mm

Factory Lead Time :

12 Weeks

ECCN Code :

EAR99

External Data Bus Width :

16

DMA Channels :

yes

RAM Size :

58K x 8

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Package / Case :

100-LQFP

HTS Code :

8542.31.00.01

Number of I/O :

70

Has ADC :

yes

Supply Voltage :

3.3V

Supply Voltage-Min (Vsup) :

3V