LPC2364FET100,518

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

RoHS Status :

ROHS3 Compliant

External Data Bus Width :

16

HTS Code :

8542.31.00.01

Surface Mount :

yes

ECCN Code :

EAR99

ROM (words) :

131072

Clock Frequency :

25MHz

Operating Temperature :

-40°C~85°C TA

Mounting Type :

Surface Mount

DAC Channels :

yes

JESD-30 Code :

S-PBGA-B100

Data Converter :

A/D 6x10b; D/A 1x10b

Power Supplies :

3.3V

Core Processor :

ARM7®

Width :

9mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Oscillator Type :

Internal

Terminal Form :

Ball

Number of I/O :

70

Bit Size :

32

Length :

9mm

Core Size :

16/32-Bit

PWM Channels :

yes

Program Memory Size :

128KB 128K x 8

Qualification Status :

Not Qualified

DMA Channels :

yes

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Terminal Position :

BOTTOM

Supply Voltage-Min (Vsup) :

3V

Terminal Pitch :

0.8mm

Packaging :

Tape and Reel (TR)

Pin Count :

100

Peak Reflow Temperature (Cel) :

260

Has ADC :

yes

RAM Size :

34K x 8

Series :

LPC2300

Peripherals :

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

JESD-609 Code :

e1

Number of Terminations :

100

Voltage - Supply (Vcc/Vdd) :

3V~3.6V

Program Memory Type :

Flash

Base Part Number :

LPC2364

Factory Lead Time :

12 Weeks

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Supply Voltage :

3.3V

Speed :

72MHz

Height Seated (Max) :

1.2mm

Supply Voltage-Max (Vsup) :

3.6V

Published :

2003

Package / Case :

100-TFBGA

Time@Peak Reflow Temperature-Max (s) :

40