LPC2364FBD100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Voltage - Supply (Vcc/Vdd) :

3V~3.6V

Surface Mount :

yes

Clock Frequency :

25MHz

Height Seated (Max) :

1.6mm

Supply Voltage-Min (Vsup) :

3V

Terminal Form :

Gull wing

Bit Size :

32

ECCN Code :

EAR99

Published :

2003

ROM (words) :

131072

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

HTS Code :

8542.31.00.01

Peripherals :

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

RoHS Status :

ROHS3 Compliant

Oscillator Type :

Internal

Operating Temperature :

-40°C~85°C TA

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Factory Lead Time :

12 Weeks

Package / Case :

100-LQFP

Mounting Type :

Surface Mount

Supply Current-Max :

100mA

Series :

LPC2300

JESD-609 Code :

e3

Speed :

72MHz

Core Processor :

ARM7®

RAM Size :

34K x 8

Width :

14mm

Program Memory Size :

128KB 128K x 8

Data Converter :

A/D 6x10b; D/A 1x10b

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Peak Reflow Temperature (Cel) :

260

Terminal Finish :

Tin (Sn)

Supply Voltage-Max (Vsup) :

3.6V

Length :

14mm

PWM Channels :

yes

External Data Bus Width :

16

Number of I/O :

70

Terminal Position :

QUAD

DAC Channels :

yes

Supply Voltage :

3.3V

Base Part Number :

LPC2364

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Pin Count :

100

Program Memory Type :

Flash

JESD-30 Code :

S-PQFP-G100

DMA Channels :

yes

Number of Terminations :

100

Qualification Status :

Not Qualified

Power Supplies :

3.3V

Terminal Pitch :

0.5mm

Has ADC :

yes

Packaging :

Tray

Core Size :

16/32-Bit