LPC2361FBD100,551

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Mfr.Part #
LPC2361FBD100,551
Manufacturer
NXP Semiconductors
Package / Case
100-LQFP
Datasheet
Download
Description
IC MCU 16/32B 64KB FLASH 100LQFP
Stock
3,153
In Stock :
3,153

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Supply Voltage :
3.3V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
100-LQFP
Number of I/O :
70
Surface Mount :
yes
Number of Terminations :
100
Qualification Status :
Not Qualified
Packaging :
Tray
JESD-609 Code :
e3
Voltage - Supply (Vcc/Vdd) :
3V~3.6V
DAC Channels :
yes
RoHS Status :
ROHS3 Compliant
Program Memory Size :
64KB 64K x 8
Length :
14mm
ECCN Code :
EAR99
RAM Size :
34K x 8
Terminal Pitch :
0.5mm
Speed :
72MHz
Peripherals :
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Power Supplies :
3.3V
Clock Frequency :
25MHz
Core Size :
16/32-Bit
DMA Channels :
yes
Height Seated (Max) :
1.6mm
Width :
14mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Factory Lead Time :
12 Weeks
Has ADC :
yes
Core Processor :
ARM7®
Supply Voltage-Max (Vsup) :
3.6V
Data Converter :
A/D 6x10b; D/A 1x10b
Pin Count :
100
Terminal Position :
QUAD
Mounting Type :
Surface Mount
Operating Temperature :
-40°C~85°C TA
ROM (words) :
65536
Program Memory Type :
Flash
Oscillator Type :
Internal
Bit Size :
32
Supply Current-Max :
100mA
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Supply Voltage-Min (Vsup) :
3V
Base Part Number :
LPC2361
Published :
2003
Connectivity :
CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peak Reflow Temperature (Cel) :
260
Series :
LPC2300
HTS Code :
8542.31.00.01
Terminal Form :
Gull wing
JESD-30 Code :
S-PQFP-G100
Terminal Finish :
Tin (Sn)
PWM Channels :
yes
Datasheets
LPC2361FBD100,551
Introducing Microcontrollers NXP Semiconductors LPC2361FBD100,551 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:100-LQFP, Number of Terminations:100, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Base Part Number:LPC2361, LPC2361FBD100,551 pinout, LPC2361FBD100,551 datasheet PDF, LPC2361FBD100,551 amp .Beyond Microcontrollers NXP Semiconductors LPC2361FBD100,551 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC2361FBD100,551


Microcontrollers NXP Semiconductors LPC2361FBD100,551 Overview

Introducing the robust LPC2361FBD100,551 by NXP Semiconductors, a microcontroller designed to deliver superior performance and reliability for demanding applications. As part of NXP's Microcontrollers category, this device is engineered using advanced 16/32-bit ARM7 architecture, ensuring efficient handling of complex operations. The LPC2361FBD100,551 is perfect for developers looking to integrate a powerful microcontroller with extensive communication capabilities and low power consumption into their designs. With 64KB of embedded flash memory and a compact 100-LQFP package, it offers a scalable solution for both prototyping and mass production, making it a favorite among industry professionals seeking performance and scalability.

LPC2361FBD100,551 Features

  • 16/32-bit ARM7TDMI-S microcontroller core running at up to 72 MHz.
  • 64KB of on-chip flash memory and 16KB of SRAM.
  • Wide range of interfaces including USB 2.0 full-speed device, CAN, SPI, I2C, UART, and more.
  • Real-time emulation and embedded trace support, alongside 58 GPIO pins.
  • Low power consumption modes for energy-efficient operations.
  • Highly integrated design housed in a 100-pin LQFP package.

LPC2361FBD100,551 Applications

  • Industrial Control Systems: Utilizes robust I/O capabilities for managing and monitoring automated tasks.
  • Medical Devices: Ensures reliable and secure performance for critical healthcare equipment.
  • Automotive Applications: Supports CAN and UART interfaces ideal for vehicle diagnostics and infotainment systems.
  • Home Automation: Integrates easily with smart home systems due to its extensive communication features.
  • Consumer Electronics: Drives innovation in gadgets like wearable technology and gaming peripherals with its powerful ARM core and multiple communication interfaces.
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