LPC2210FBD144/01K
- Mfr.Part #
- LPC2210FBD144/01K
- Manufacturer
- NXP Semiconductors
- Package / Case
- 144-LQFP
- Datasheet
- Download
- Description
- IC MCU 16/32BIT ROMLESS 144LQFP
- Stock
- 4,182
- In Stock :
- 4,182
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- Microcontrollers
- Series :
- LPC2200
- Maximum Operating Temperature (°C) :
- 85
- Typical Operating Supply Voltage (V) :
- 1.8|3.3
- Maximum CPU Frequency (MHz) :
- 60
- UART :
- 0
- Minimum Operating Supply Voltage (V) :
- 3|1.65|2.5
- Product Type :
- ARM Microcontrollers - MCU
- Maximum Power Dissipation (mW) :
- 1500
- Core Size :
- 16/32-Bit
- Base Product Number :
- LPC2210
- Interface Type :
- I2C/SPI
- USART :
- 0
- RoHS :
- Details
- Family Name :
- LPC2000
- Supplier Package :
- LQFP
- Minimum Operating Temperature :
- - 40 C
- Number of ADCs :
- Single
- Pin Count :
- 144
- Package Length :
- 20.1(Max)
- Voltage - Supply (Vcc/Vdd) :
- 1.65V ~ 3.6V
- Brand :
- NXP Semiconductors
- Instruction Set Architecture :
- RISC
- Core Architecture :
- ARM
- RAM Size :
- 16kB
- Mounting :
- Surface Mount
- No. of Timers :
- 2
- Peripherals :
- POR, PWM, WDT
- Data Bus Width (bit) :
- 16|32
- RoHS Status :
- RoHS Compliant
- Data Bus Width :
- 32 bit/16 bit
- Subcategory :
- Microcontrollers - MCU
- EEPROM Size :
- -
- HTS :
- 8542.31.00.01
- Oscillator Type :
- Internal
- Number of I/O :
- 76
- USB :
- 0
- Operating Temperature :
- -40°C ~ 85°C (TA)
- Standard Package Name :
- QFP
- Mounting Type :
- Surface Mount
- Number of I/Os :
- 76 I/O
- Mounting Style :
- SMD/SMT
- Minimum Operating Temperature (°C) :
- -40
- Maximum Operating Temperature :
- + 85 C
- Package :
- Bulk
- Maximum Clock Rate (MHz) :
- 60
- Core Processor :
- ARM7®
- Supplier Temperature Grade :
- Industrial
- Device Core :
- ARM7TDMI-S
- ADC Resolution (bit) :
- 10
- Lead Shape :
- Gull-wing
- I2S :
- 0
- Program Memory Size :
- -
- Supplier Device Package :
- 144-LQFP (20x20)
- Programmability :
- No
- PCB changed :
- 144
- ECCN (US) :
- EAR99
- Manufacturer :
- NXP
- Package Width :
- 20.1(Max)
- Package Height :
- 1.45(Max)
- Ethernet :
- 0
- Packaging :
- Tray
- Operating Supply Voltage :
- 1.65 V to 1.95 V
- Package / Case :
- 144-LQFP
- Product Category :
- ARM Microcontrollers - MCU
- I2C :
- 1
- Connectivity :
- EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
- Program Memory Type :
- ROMless
- Product Status :
- Active
- SPI :
- 2
- Data Converters :
- A/D 8x10b
- Maximum Operating Supply Voltage (V) :
- 1.95|3.6
- Speed :
- 75MHz
- Datasheets
- LPC2210FBD144/01K
LPC2210FBD144/01K Documents

Microcontrollers NXP Semiconductors LPC2210FBD144/01K Overview
The Microcontrollers NXP Semiconductors LPC2210FBD144/01K is a versatile and powerful integrated circuit specifically engineered for demanding applications where efficiency and reliability are paramount. This robust microcontroller unit (MCU) from NXP Semiconductors seamlessly blends 16/32-bit processing capabilities with a ROMless configuration, offering exceptional flexibility and customization. It is housed in a 144-LQFP (Low-profile Quad Flat Package), ensuring compact integration into various electronic assemblies. This product is ideally suited for developers looking to design systems with specific memory and software requirements, offering a scalable platform for a wide range of industrial and commercial applications.
LPC2210FBD144/01K Features
This microcontroller provides a robust platform for sophisticated circuit designs, featuring a 16/32-bit ARM7TDMI-S core that delivers efficient processing and power management capabilities. The absence of onboard ROM encourages designers to implement their tailored memory solutions, making the LPC2210FBD144/01K highly adaptable to specific project needs. Its extensive I/O options and compatibility with a range of peripherals enhance its utility in complex electronic systems.
LPC2210FBD144/01K Applications
- Industrial Automation: Integrates into control systems for sensors, actuators, and other automation components, enhancing process efficiency and reliability.
- Medical Devices: Serves as the processing core in medical diagnostic equipment, offering reliable computation for critical health applications.
- Automotive Applications: Utilized in vehicle management systems where precision and dependability are crucial for performance and safety.
- Communication Systems: Forms the backbone of wired and wireless communication devices, ensuring robust data handling and transmission capabilities.
- Consumer Electronics: Drives innovative consumer products, from gaming consoles to smart home devices, with its versatile processing power.
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