LM3S9DN5-IBZ80-A1

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Mfr.Part #
LM3S9DN5-IBZ80-A1
Manufacturer
Texas Instruments
Package / Case
108-LFBGA
Datasheet
Download
Description
IC MCU 32BIT 512KB FLASH 108BGA
Stock
25,580
In Stock :
25,580

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Manufacturer :
Texas Instruments
Product Category :
Microcontrollers
Number of I/O :
72
Length :
10mm
DAC Channels :
No
Number of UART Channels :
3
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
Number of Pins :
108
Width :
10mm
Packaging :
Tray
Number of A/D Converters :
2
Frequency :
80MHz
Mount :
Surface Mount
Core Processor :
ARM® Cortex®-M3
Pin Count :
108
Number of Timers/Counters :
4
Terminal Form :
Ball
Height Seated (Max) :
1.5mm
Package / Case :
108-LFBGA
DMA Channels :
yes
PWM Channels :
yes
Terminal Pitch :
0.8mm
Has ADC :
yes
Core Architecture :
ARM
Interface :
CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SPI, UART, USART, USB
Supply Voltage :
3.3V
Base Part Number :
LM3S9DN5
Program Memory Type :
Flash
Terminal Position :
BOTTOM
Program Memory Size :
512KB 512K x 8
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
RAM Size :
96K x 8
Data Converter :
A/D 16x12b
Series :
Stellaris® ARM® Cortex®-M3S 9000
Number of Terminations :
108
Oscillator Type :
Internal
Supply Voltage-Min (Vsup) :
3V
Number of Bits :
12
Mounting Type :
Surface Mount
Bit Size :
32
Voltage - Supply (Vcc/Vdd) :
1.235V~1.365V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
ROHS3 Compliant
Peripherals :
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Operating Temperature :
-40°C~85°C TA
Memory Size :
512kB
Core Size :
32-Bit
Lead Free :
Contains Lead
Datasheets
LM3S9DN5-IBZ80-A1
Introducing Microcontrollers Texas Instruments LM3S9DN5-IBZ80-A1 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:108, Package / Case:108-LFBGA, Base Part Number:LM3S9DN5, Number of Terminations:108, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, LM3S9DN5-IBZ80-A1 pinout, LM3S9DN5-IBZ80-A1 datasheet PDF, LM3S9DN5-IBZ80-A1 amp .Beyond Microcontrollers Texas Instruments LM3S9DN5-IBZ80-A1 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments LM3S9DN5-IBZ80-A1


Microcontrollers Texas Instruments LM3S9DN5-IBZ80-A1 Overview

The Microcontrollers Texas Instruments LM3S9DN5-IBZ80-A1 is a high-performance, 32-bit microcontroller unit (MCU) designed for advanced embedded applications. Manufactured by Texas Instruments, a leader in semiconductor innovation, this MCU leverages ARM Cortex-M3 processing architecture to provide robust computational power and enhanced functionality. With 512KB of flash memory and a compact 108-BGA package, it is ideal for demanding applications where space and power efficiency are crucial. The integration of numerous peripherals and high-speed connectivity options makes it exceptionally versatile for a wide range of industrial and commercial applications.

LM3S9DN5-IBZ80-A1 Features

  • 32-bit ARM Cortex-M3 processor offering exceptional processing power.
  • 512KB of flash memory for substantial code and data storage.
  • 108-BGA package allows for a compact design, facilitating smaller form factor applications.
  • Extensive integration of peripherals including UART, PWM, ADC, and more, enhancing its functionality.
  • Supports multiple communication protocols, suitable for complex digital networking needs.

LM3S9DN5-IBZ80-A1 Applications

  • Industrial Automation: Utilized in control systems for machinery where robust processing and multiple I/O interfaces are necessary for system management and operations monitoring.
  • Medical Devices: Supports the development of medical monitoring systems requiring high reliability and precision in data handling and real-time patient monitoring.
  • Consumer Electronics: Ideal for smart home devices and portable electronics where efficient power management and compact design are critical.
  • Automotive: Used in automotive control systems, including engine management and infotainment systems, where durability and performance are key.
  • Communication Systems: Forms the core of communication infrastructure, supporting complex protocol handling and data throughput demands.
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