LM3S8970-IBZ50-A2

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Mfr.Part #
LM3S8970-IBZ50-A2
Manufacturer
Texas Instruments
Package / Case
108-LFBGA
Datasheet
Download
Description
IC MCU 32BIT 256KB FLASH 108BGA
Stock
6,255
In Stock :
6,255

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Manufacturer :
Texas Instruments
Product Category :
Microcontrollers
Number of Pins :
108
Mount :
Surface Mount
Radiation Hardening :
No
Number of ADC Channels :
0
Connectivity :
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Lead Free :
Lead Free
Length :
10mm
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Core Architecture :
ARM
Operating Supply Voltage :
3.3V
Terminal Position :
BOTTOM
Number of Timers/Counters :
6
Terminal Form :
Ball
Data Bus Width :
32b
JESD-609 Code :
e1
Interface :
CAN, Ethernet, I2C, IrDA, SPI, UART, USART
Voltage - Supply (Vcc/Vdd) :
2.25V~2.75V
RoHS Status :
ROHS3 Compliant
Has ADC :
yes
Pin Count :
108
Peripherals :
Brown-out Detect/Reset, POR, PWM, WDT
Peak Reflow Temperature (Cel) :
260
Core Processor :
ARM® Cortex®-M3
Bit Size :
32
PWM Channels :
yes
Number of Terminations :
108
Height Seated (Max) :
1.5mm
Core Size :
32-Bit
DMA Channels :
No
Packaging :
Tape and Reel (TR)
Frequency :
50MHz
RAM Size :
64K x 8
Operating Temperature :
-40°C~85°C TA
Supply Voltage :
2.5V
Series :
Stellaris® ARM® Cortex®-M3S 8000
Memory Size :
256KB
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Watchdog Timer :
yes
Oscillator Type :
Internal
Base Part Number :
LM3S8970
Number of I/O :
46
Package / Case :
108-LFBGA
Number of UART Channels :
2
Program Memory Size :
256KB 256K x 8
Mounting Type :
Surface Mount
Program Memory Type :
Flash
Datasheets
LM3S8970-IBZ50-A2
Introducing Microcontrollers Texas Instruments LM3S8970-IBZ50-A2 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:108, Number of Terminations:108, Operating Temperature:-40°C~85°C TA, Base Part Number:LM3S8970, Package / Case:108-LFBGA, Mounting Type:Surface Mount, LM3S8970-IBZ50-A2 pinout, LM3S8970-IBZ50-A2 datasheet PDF, LM3S8970-IBZ50-A2 amp .Beyond Microcontrollers Texas Instruments LM3S8970-IBZ50-A2 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments LM3S8970-IBZ50-A2


Microcontrollers Texas Instruments LM3S8970-IBZ50-A2 Overview

The Texas Instruments LM3S8970-IBZ50-A2 microcontroller is engineered to meet the demanding requirements of modern embedded applications. As part of the renowned Texas Instruments microcontroller line, this device integrates a robust 32-bit ARM Cortex-M3 processor with 256KB of flash memory, all encapsulated in a compact 108-ball grid array (BGA) package. This microcontroller is ideal for designers focusing on industrial, communication, and automation applications, offering a blend of performance, reliability, and flexibility that is essential for complex digital and analog functionalities. The Microcontrollers Texas Instruments LM3S8970-IBZ50-A2 is tailored to enhance system efficiency and reduce time-to-market, making it a top choice for B2B customers seeking volume purchases.

LM3S8970-IBZ50-A2 Features

This microcontroller features a high-performance 32-bit ARM Cortex-M3 core, providing efficient handling of complex algorithms and control tasks. With 256KB of onboard flash memory, it supports extensive codebases and data logging operations without the need for external storage components. The integration into a 108BGA package ensures minimal footprint and enhanced reliability in harsh environments. Additional features such as multiple I/O ports, serial communication interfaces (including I2C, SPI, UART), and a range of built-in analog peripherals (ADCs, DACs) enhance its adaptability to various applications.

LM3S8970-IBZ50-A2 Applications

  • Industrial Automation: Used in the control systems of assembly lines, where precision and reliability are paramount. The robust processing capabilities of the LM3S8970-IBZ50-A2 ensure smooth operation and real-time decision-making in complex industrial environments.
  • Home Automation Systems: Integrates into smart home devices, providing core processing power for automated lighting, security, and climate control systems, thus enhancing user experience and system efficiency.
  • Medical Devices: Employs in portable medical diagnostics and monitoring equipment, where accurate data processing and device miniaturization are critical. The compact form factor and powerful processor make it ideal for these applications.
  • Communication Equipment: Utilized in communication infrastructure, such as modems and routers, ensuring reliable data transfer and connectivity critical in modern communication technologies.
  • Consumer Electronics: Serves as the central processor in various consumer electronics, such as gaming consoles and personal digital assistants, providing the necessary computational power and connectivity options for enhanced user interaction and entertainment.
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