LFX1200EB-03F900C
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- Mfr.Part #
- LFX1200EB-03F900C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 496 I/O 900FBGA
- Stock
- 4,281
- In Stock ：
- 4,281
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Package / Case :
- 900-BBGA
- Total RAM Bits :
- 423936
- Height Seated (Max) :
- 2.6mm
- RoHS Status :
- Non-RoHS Compliant
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Position :
- BOTTOM
- Combinatorial Delay of a CLB-Max :
- 1.07 ns
- Mounting Type :
- Surface Mount
- Number of Terminations :
- 900
- Base Part Number :
- LFX1200
- Operating Supply Voltage :
- 2.5V
- Number of Outputs :
- 496
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Power Supplies :
- 2.5/3.3V
- Number of CLBs :
- 3844
- RAM Size :
- 51.8kB
- Clock Frequency :
- 320MHz
- Width :
- 31mm
- Number of I/O :
- 496
- HTS Code :
- 8542.39.00.01
- JESD-609 Code :
- e0
- Series :
- ispXPGA®
- Voltage - Supply :
- 2.3V~3.6V
- Number of Logic Elements/Cells :
- 15376
- Memory Size :
- 82.5kB
- Published :
- 2000
- ECCN Code :
- EAR99
- Number of Pins :
- 900
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Packaging :
- Tray
- Supply Voltage :
- 2.5V
- Peak Reflow Temperature (Cel) :
- 225
- Qualification Status :
- Not Qualified
- Reach Compliance Code :
- not_compliant
- Length :
- 31mm
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Mount :
- Surface Mount
- Pin Count :
- 900
- Terminal Pitch :
- 1mm
- Additional Feature :
- ALSO OPERATES WITH 3.3V SUPPLY
- Number of Gates :
- 1250000
- Terminal Form :
- Ball
- Datasheets
- LFX1200EB-03F900C
FPGAs Lattice Semiconductor LFX1200EB-03F900C Overview
Introducing the high-performance FPGAs Lattice Semiconductor LFX1200EB-03F900C, a leading-edge Field Programmable Gate Array (FPGA) that embodies innovation and versatility for complex digital systems. Designed by Lattice Semiconductor, this FPGA features a robust 900FBGA package, making it an ideal choice for developers requiring extensive I/O capabilities and substantial programmability. The LFX1200EB-03F900C is engineered to cater to high-demand applications, offering a blend of power efficiency and high-speed performance. Its adaptability ensures it meets varied industry requirements, making it a go-to solution for designers aiming at optimizing both performance and cost.
LFX1200EB-03F900C Features
This FPGA is equipped with 496 I/O pins, providing ample connectivity options for various peripherals and interfaces. The compact 900FBGA package ensures a minimal footprint on system boards, which is critical for space-sensitive applications. This device supports a wide range of configuration options, enabling highly customizable designs that can adapt to specific user requirements or application demands.
LFX1200EB-03F900C Applications
- Telecommunications: Utilized in networking equipment such as routers and switches, the LFX1200EB-03F900C can manage multiple data streams and protocols efficiently, enhancing bandwidth and reducing latency.
- Consumer Electronics: Integral to devices like high-definition televisions and gaming consoles, this FPGA helps to handle complex graphics processing and user interface management, ensuring smooth and responsive performance.
- Automotive: Applied in advanced driver-assistance systems (ADAS), the FPGA processes inputs from multiple sensors to provide real-time decision-making support, increasing road safety and vehicle automation.
- Industrial Automation: In factory settings, the LFX1200EB-03F900C streamlines processes through its ability to synchronize multiple control systems, thereby improving efficiency and reliability in production lines.
- Medical Devices: Used in medical imaging systems, such as MRI and ultrasound machines, it supports intricate signal processing tasks that are essential for producing high-resolution images.
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