LFE2M70SE-7F900C

Share

Or copy the link below:

Mfr.Part #
LFE2M70SE-7F900C
Manufacturer
Lattice Semiconductor
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 416 I/O 900FBGA
Stock
45,938
In Stock :
45,938

Request A Quote(RFQ)

* Fullname:
* Company:
* E-Mail:
  Phone:
  Comment:
* Quantity:
Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Series :
ECP2M
Base Part Number :
LFE2M70
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
ECCN Code :
EAR99
Mounting Type :
Surface Mount
Memory Size :
584.9kB
Lead Free :
Lead Free
Number of LABs/CLBs :
8375
Terminal Finish :
Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s) :
30
Pin Count :
900
Number of Pins :
900
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
HTS Code :
8542.39.00.01
Number of Logic Elements/Cells :
67000
Terminal Form :
Ball
Number of I/O :
416
Voltage - Supply :
1.14V~1.26V
Operating Temperature :
0°C~85°C TJ
Terminal Position :
BOTTOM
RoHS Status :
Non-RoHS Compliant
Pbfree Code :
No
Operating Supply Voltage :
1.2V
Terminal Pitch :
1mm
Qualification Status :
Not Qualified
Clock Frequency :
420MHz
Mount :
Surface Mount
Number of Logic Cells :
70000
Combinatorial Delay of a CLB-Max :
0.304 ns
Total RAM Bits :
4642816
RAM Size :
566.8kB
Packaging :
Tray
Width :
31mm
Supply Voltage :
1.2V
JESD-609 Code :
e0
Height Seated (Max) :
2.6mm
Reach Compliance Code :
not_compliant
Number of Terminations :
900
Package / Case :
900-BBGA
Number of Outputs :
416
Peak Reflow Temperature (Cel) :
225
Published :
2012
Length :
31mm
Datasheets
LFE2M70SE-7F900C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M70SE-7F900C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LFE2M70, Mounting Type:Surface Mount, Number of Pins:900, Operating Temperature:0°C~85°C TJ, Number of Terminations:900, Package / Case:900-BBGA, LFE2M70SE-7F900C pinout, LFE2M70SE-7F900C datasheet PDF, LFE2M70SE-7F900C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M70SE-7F900C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE2M70SE-7F900C


FPGAs Lattice Semiconductor LFE2M70SE-7F900C Overview

The FPGAs Lattice Semiconductor LFE2M70SE-7F900C is a high-performance, programmable logic device that boasts extensive application flexibility and integration capabilities. Engineered by Lattice Semiconductor, a leader in low power FPGA technology, this device supports complex digital systems with its robust 416 I/O pins encapsulated in a compact 900FBGA package. Ideal for demanding applications where space and power efficiency are critical, the LFE2M70SE-7F900C offers an optimal solution for a range of industrial designs. Its advanced features make it a top choice for designers looking to enhance system performance while reducing overall power consumption.

LFE2M70SE-7F900C Features

This FPGA model provides significant advantages for system design scalability and adaptability. Key features include a high pin count interface for flexible connectivity options, a dense ball grid array package for reliable electrical connections, and low-power operation to enhance energy efficiency. Additionally, the LFE2M70SE-7F900C supports a variety of configuration memories, simplifying system integration and providing designers with multiple options to optimize their hardware performance.

LFE2M70SE-7F900C Applications

  • Industrial Control Systems: Utilizes its high I/O count and robust processing capabilities to manage complex sensor arrays and actuator networks, enhancing automation and efficiency.
  • Automotive Technology: Employs its robust performance and low-power operation to control and manage automotive electronics, including advanced driver-assistance systems (ADAS) and infotainment systems.
  • Consumer Electronics: Perfect for integration into consumer electronics due to its compact size and efficient power usage, ideal for smart home devices and portable electronics.
  • Communications Infrastructure: Supports high-speed data processing and connectivity, crucial for base station development, network routers, and other communication equipment.
  • Medical Devices: Enables reliable and precise control in medical imaging and diagnostic equipment, benefiting from its high data throughput and configurability.
Purchase

You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.

RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

RFQ
BOM