LFE2M70SE-6F900C
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- Mfr.Part #
- LFE2M70SE-6F900C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 416 I/O 900FBGA
- Stock
- 20,222
- In Stock ：
- 20,222
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Base Part Number :
- LFE2M70
- Height Seated (Max) :
- 2.6mm
- Series :
- ECP2M
- Qualification Status :
- Not Qualified
- Operating Temperature :
- 0°C~85°C TJ
- Published :
- 2012
- Memory Size :
- 584.9kB
- RoHS Status :
- Non-RoHS Compliant
- Reach Compliance Code :
- not_compliant
- JESD-609 Code :
- e0
- Operating Supply Voltage :
- 1.2V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1mm
- ECCN Code :
- EAR99
- Total RAM Bits :
- 4642816
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Combinatorial Delay of a CLB-Max :
- 0.331 ns
- Clock Frequency :
- 357MHz
- Supply Voltage :
- 1.2V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mounting Type :
- Surface Mount
- Number of Logic Cells :
- 70000
- Number of Pins :
- 900
- Voltage - Supply :
- 1.14V~1.26V
- RAM Size :
- 566.8kB
- Number of I/O :
- 416
- Packaging :
- Tray
- Pin Count :
- 900
- Peak Reflow Temperature (Cel) :
- 225
- Lead Free :
- Lead Free
- Length :
- 31mm
- Terminal Form :
- Ball
- Number of Logic Elements/Cells :
- 67000
- Mount :
- Surface Mount
- Pbfree Code :
- No
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Package / Case :
- 900-BBGA
- Number of LABs/CLBs :
- 8375
- HTS Code :
- 8542.39.00.01
- Width :
- 31mm
- Number of Terminations :
- 900
- Terminal Position :
- BOTTOM
- Number of Outputs :
- 416
- Datasheets
- LFE2M70SE-6F900C
LFE2M70SE-6F900C Documents
FPGAs Lattice Semiconductor LFE2M70SE-6F900C Overview
The FPGAs Lattice Semiconductor LFE2M70SE-6F900C is a high-performance, field-programmable gate array designed for sophisticated applications that require high-speed, reliable interconnectivity, and extensive I/O options. This product features an extensive array of 416 I/O pins housed in a compact 900FBGA package, making it an ideal choice for designers looking to optimize their system design with a scalable and flexible architecture. The chip is well-suited for deployment in a variety of demanding environments, providing robust solutions that engineers and developers rely on to innovate and accelerate time-to-market.
LFE2M70SE-6F900C Features
This FPGA model boasts a range of features that enhance its utility and effectiveness in complex digital circuits. Key features include a high I/O pin count, a dense 900FBGA packaging, and advanced configuration capabilities that allow for extensive customization. The FPGA's design and performance characteristics make it ideal for handling substantial data processing tasks and multi-functional integration on a single chip, thereby reducing overall system complexity and enhancing performance.
LFE2M70SE-6F900C Applications
- Telecommunications Equipment: Utilized in routers and switches for packet processing and data flow management, enhancing the performance and reliability of network infrastructure.
- Automotive Systems: Integrated into automotive safety and management systems, this FPGA helps manage sensor inputs and actuator outputs, improving vehicle response and safety features.
- Industrial Automation: Applied in the control systems of automated production lines, improving process efficiency and equipment coordination.
- Consumer Electronics: Used in high-definition multimedia interfaces and digital video recorders, ensuring smooth video processing and data transmission.
- Medical Devices: Plays a critical role in diagnostic and imaging systems, facilitating faster data analysis and real-time imaging capabilities.
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