LFE2M70E-7FN1152C

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Mfr.Part #
LFE2M70E-7FN1152C
Manufacturer
Lattice Semiconductor
Package / Case
1152-BBGA
Datasheet
Download
Description
IC FPGA 436 I/O 1152FBGA
Stock
25,285
In Stock :
25,285

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Pbfree Code :
yes
Terminal Position :
BOTTOM
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of I/O :
436
Number of Logic Cells :
70000
Terminal Pitch :
1mm
Operating Supply Voltage :
1.2V
ECCN Code :
EAR99
Height Seated (Max) :
2.6mm
Total RAM Bits :
4642816
Combinatorial Delay of a CLB-Max :
0.304 ns
Lead Free :
Lead Free
RAM Size :
566.8kB
RoHS Status :
ROHS3 Compliant
Number of Outputs :
436
Base Part Number :
LFE2M70
Number of LABs/CLBs :
8375
Memory Size :
584.9kB
Clock Frequency :
420MHz
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Series :
ECP2M
Voltage - Supply :
1.14V~1.26V
Time@Peak Reflow Temperature-Max (s) :
30
Mount :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Logic Elements/Cells :
67000
HTS Code :
8542.39.00.01
Package / Case :
1152-BBGA
Packaging :
Tray
Number of Pins :
1152
Published :
2012
Width :
35mm
Radiation Hardening :
No
Factory Lead Time :
8 Weeks
Terminal Form :
Ball
Operating Temperature :
0°C~85°C TJ
JESD-609 Code :
e1
Mounting Type :
Surface Mount
Length :
35mm
Supply Voltage :
1.2V
Peak Reflow Temperature (Cel) :
250
Datasheets
LFE2M70E-7FN1152C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M70E-7FN1152C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LFE2M70, Package / Case:1152-BBGA, Number of Pins:1152, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, LFE2M70E-7FN1152C pinout, LFE2M70E-7FN1152C datasheet PDF, LFE2M70E-7FN1152C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M70E-7FN1152C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE2M70E-7FN1152C


FPGAs Lattice Semiconductor LFE2M70E-7FN1152C Overview

Introducing the LFE2M70E-7FN1152C, a high-performance FPGA from Lattice Semiconductor, designed to meet the demanding requirements of sophisticated electronic applications. This FPGA is engineered to deliver exceptional versatility with its substantial logic density and extensive I/O capabilities. The LFE2M70E-7FN1152C is ideal for developers looking to integrate a single chip that offers vast configurability and the ability to drive complex, multi-functional designs in compact, power-efficient formats. Featuring a robust 1152FBGA package, it supports extensive scalability and rapid prototyping, making it a top choice for innovation in a variety of industries.

LFE2M70E-7FN1152C Features

The LFE2M70E-7FN1152C FPGA boasts a broad array of features, including 436 I/O pins that allow for flexible interfacing with a wide range of peripheral devices. It is built on Lattice Semiconductor's advanced FPGA technology that ensures lower power consumption while maximizing speed and reliability. The 1152FBGA packaging not only aids in robust physical protection but also facilitates efficient heat dissipation and improved signal integrity. This makes the FPGA an ideal solution for developers looking to leverage advanced digital logic in a compact and efficient design.

LFE2M70E-7FN1152C Applications

  • Telecommunications Equipment: Utilizes its high I/O count and configurability to manage data-intensive functions such as signal processing and network traffic management.
  • Automotive Applications: Supports advanced driver assistance systems (ADAS) by processing multiple sensor inputs and providing real-time responses.
  • Consumer Electronics: Ideal for use in high-definition multimedia interfaces and portable electronic devices, thanks to its low power consumption and small form factor.
  • Industrial Automation: Enhances control systems by integrating multiple functions on a single chip, which simplifies design and increases reliability in harsh environments.
  • Medical Devices: Used in diagnostic and imaging systems to handle complex computations and data management required for real-time analysis.
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